Cirexx Introduces Eclisp, An Alternative to Co-fired Ceramics


Reading time ( words)

Al Wasserzug, SR Business Development Exec at Cirexx talks about their new product, Eclisp. Developed in conjunction with Lockheed Martin, Eclisp is an alternative to co-fired ceramics and used to evacuate heat very efficiently with a low CTE. Wasserzug gave a paper on the new technology at IPC APEX EXPO.

Watch this video

Share

Print


Suggested Items

Arlon Takes on High-Power Failure

04/02/2020 | Real Time with...IPC
In this video interview from IPC APEX EXPO, Pete Starkey and Dave Nelson, director of business development at Arlon Electronic Materials, explore causes of failure in high-power PCBs and explain how resin cracking during drilling can be overcoming using thermally conductive filled resin.

The Formation of the Printed Circuit Engineering Association

04/02/2020 | Patty Goldman, I-Connect007
Patty Goldman spoke with Gary Ferrari, FTG Corporation, at IPC APEX EXPO 2020 about the formation of the Printed Circuit Engineering Association, which—having been started two months ago—has attained lots of interest from the industry. The PCEA hopes to bring together designers, engineers, fabricators, assemblers through local chapters to focus mainly on education and learning.

DownStream: Smoothing out the Post-Processing Bumps

03/18/2020 | Real Time with...IPC
In this video interview from the show, Joe Clark, co-founder of DownStream Technologies, gives Guest Editor Kelly Dack an overview of the company and their innovative product line, which serves to smooth the bumps that can occur between source design output and manufacturing line input. As Joe explains, 2019 was a great year for the company, and he expects that trend to hold through 2020.



Copyright © 2020 I-Connect007. All rights reserved.