Flexible Thinking: The Benefits of Employing a Standard Grid Pitch in Design

Since the time of their introduction, area array packaging such as BGAs, area array CSPs, and wafer-level packages have been extolled for their ability to simultaneously improve product performance and assembly yield while reducing overall system cost. Because of these important advantages, the industry was enticed to adapt to area array packaging. The benefits of area array interconnection became abundantly clear when it was realized that the previous generation of packaging solutions based on peripherally leaded packaging concepts would not carry the electronics industry into the future.

As peripherally leaded packages grew in size to support increasing pin counts required by more highly integrated ICs, the packages began sapping device performance while consuming more PCB real estate. Area array packages were promptly recognized as a highly promising solution however there were lots of unanswered questions relative to manufacturing and inspection of these new devices. There was some knowledge but it was limited to OEMs who had embraced area array methods for internal designs.

The industry at large needed to jump on the learning curve and overcome its fear of the unknown. One of the most vexing concerns at the time (and arguably still today) is that terminations beneath the area array package were unseeable. Given the fact that then, as today, solder joints were a major cause of failure, there was much consternation over the quality of the joints. New equipment and methods, such as x-ray inspection, were applied and the industry made rapid progress in developing materials and processes that assuaged those fears and allowed the industry to continue to design and manufacture ever improved products at lower costs.

However, in the industry’s rush to take immediate satisfaction of the benefits of area array packaging, it collectively failed to consider some highly significant overall benefits made possible by area array packaging—the potential to design assemblies with every component having terminations that could land on a standard grid.

To read this entire article, which appeared in the February 2017 issue of The PCB Design Magazine, click here.

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2017

Flexible Thinking: The Benefits of Employing a Standard Grid Pitch in Design

03-31-2017

The industry at large needed to jump on the learning curve and overcome its fear of the unknown. One of the most vexing concerns at the time (an arguably still today) is that terminations beneath the area array package were unseeable. Given the fact that then, as today, solder joints were a major cause of failure, there was much consternation over the quality of the joints.

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2016

Flexible Thinking: Process Engineering—PCB Manufacturing’s ‘Delta Force’

05-11-2016

Process engineers serve a vital function on the front line of printed circuit manufacturing. They are often, if you will, the “Delta Force” that subdues and controls that which is one of the mortal enemies of manufacturing…process variation.

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2015

3D Printing in Electronics - A Perspective

01-14-2015

Knowing the value of a product or technology is key to making the right decision. Appreciating the value of an element of business is evermore important as the rate of change surrounding an industry accelerates. This brings us to one of the current buzz subjects in our industry: 3D printing. Understanding what it is and what its value is to a company and that company's ability to improve its place in the industry is vital.

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2013

The E.I. Files: The Electronics Industry's Black Swans

07-31-2013

First proposed in 2007, there is a potential electronics industry "black swan" technology quietly being developed and refined. It is one that could greatly and positively impact, at once, the cost, reliability, and environmental friendliness of electronic manufacturing by simply eliminating the soldering process.

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Flex Circuits and Photonics: A Pairing for the Future, and the Here and Now

04-17-2013

Photons are making continuous headway into the world of electronics. One thing that the basic data carriers (electrons, microwaves and photons) have in common is that flexible circuits are being increasingly looked to for help in managing their data transmission function.

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2012

Stretching the Limits of Flex

11-29-2012

Those steeped in flexible circuit design and manufacture for any length of time fully appreciate the long list of benefits that only flexible circuits can offer. Some of the most fundamental benefits of flex circuit technology have been exploited since the earliest days of the technology. Joe Fjelstad explains.

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Flexible Thinking: Circuit Flexibility (and How to Achieve it)

10-04-2012

The most common interpretation of the word flexible, as applied to the flex circuits that the industry currently makes, is something capable of being bent repeatedly without breaking. Joe Fjelstad discusses a few other definitions of flexible that are worthy of consideration when using the term, for their ability to unlock new thinking patterns relative to what is flexible.

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Technology Roadmaps: Thoughts and Observations

09-26-2012

If one is without a sense of the direction their technology is headed, odds are that they will sooner find themselves on the road to ruin than the road to success. A technology roadmap is a critical tool in helping a company make informed decisions. By Joe Fjelstad.

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2011

Something Old, Something New: Stretchable Circuits and Elastronics

10-13-2011

The stretching of circuits to alternately increase and decrease the length of a circuit has proven useful for electronic products and assemblies for years. Stretchable circuit technology and elastronics are poised to take on challenges that cannot be easily met by flexible circuit technology alone. Keep them in mind next time you find yourself in need of a little more "spring" in your design. By Joe Fjelstad.

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Stretchable Circuits: The Emergence of "Elastronics"

07-14-2011

The stretchable circuit is an interesting and promising new branch on the flexible circuit tree. The stretching of circuits to alternately increase and decrease the length of a circuit has proven useful for many years. The European Union has funded research in this area through such initiatives as the STELLA project.

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2010

Flexible Thinking: An Alternative Approach to Rigid-Flex Assembly

11-18-2010

The fundamental approach to manufacturing rigid-flex has remained constant for the 40-plus years of rigid-flex history. But is there a better way? What if one could produce a circuit that was rigid throughout the manufacturing process and only become flexible in the final step? In other words, what if one could make a rigid circuit assembly, flex?

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Reasons Why The Flex Market Continues to Shine

10-07-2010

According to IPC market statistics, flexible circuits continue to be the brightest sector of the overall printed circuit market. The reasons for this are many but, at the end of the day, it generally boils down to the fact that flexible circuits are an excellent way to solve interconnection challenges in a cost-effective way.

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Flexible Thinking: Flexible Structures for Data Transmission

08-12-2010

Flexible circuit cables offer some significant advantages for facilitating the movement of data between elements of a system that must also be moved or flexed. However, there is a balancing act involved and there is more than one master to be served to create a system that is robust, reliable and easily manufacturable.

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Flexible Thinking: Supporting Components on Flex Circuit Assemblies

07-21-2010

With proper planning, stiffeners can be designed to aid assembly through the designed manufacture of a flex circuit that can be handled as if it were a rigid circuit board. Such constructions can be accomplished by using any one of several methods.

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A Simple Approach to Flex Manufacture, Assembly

04-29-2010

Flexibility, the single attribute that makes flex so attractive, also makes flex circuits more difficult to build. What if we could produce a circuit that was rigid throughout the entire manufacturing process and only become flexible in the final step?

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