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IPC APEX EXPO Technical Session Preview
01/27/2020 | Nolan Johnson, PCB007
IPC Validation Services: What to Expect at IPC APEX EXPO 2020
01/24/2020 | Nolan Johnson, PCB007
IPC APEX EXPO Technical Conference, Featuring Fundamentals and the Intersection
01/23/2020 | Brook Sandy-Smith, IPC
Streamlining Inspection and Verification
01/23/2020 | Barry Matties, I-Connect007
IPC APEX EXPO: Sessions @ the Intersection
01/22/2020 | IPC
IPC APEX EXPO Technical Session Preview
Brook Sandy-Smith, IPC technical conference program manager, previews the technical side of IPC APEX EXPO 2020, which includes the customary technical sessions, but also some new wrinkles like the fundamentals program and “sessions @ the intersection” to encourage more interaction.
IPC Validation Services: What to Expect at IPC APEX EXPO 2020
IPC’s Randy Cherry previews what to expect from IPC APEX EXPO 2020, including a full line on display demonstrating CFX/Hermes, further development of the Validation Services program, as well as testimonials from member companies that have been participating in IPC’s new trusted supplier program to the Department of Defense (DoD).
IPC APEX EXPO Technical Conference, Featuring Fundamentals and the Intersection
IPC's Brook Sandy-Smith brings us a preview of the Technical Conference at IPC APEX EXPO 2020. In addition to the Sessions @ the Intersection and the Technical Conference, the Fundamentals Program is new at IPC APEX EXPO 2020. The program provides curated content for industry newcomers and anyone interested in a broader view through the many facets of electronics manufacturing. Attendees will learn important concepts, terminology, and background as preparation for the detailed content on new studies and technologies presented at the technical conference.
Streamlining Inspection and Verification
Barry Matties speaks with Vladi Kaplan, VP of marketing for CIMS, about the company’s newest verification station, the benefits operators will see from its colorized real-time video, and how it makes verification much faster and much more efficient for companies pushing 100% inspection.
IPC APEX EXPO: Sessions @ the Intersection
In this short video, Brook Sandy-Smith, IPC’s technical conference program manager, explains how “the lntersection” will be a new meeting place In between this year's IPC APEX EXPO show floor and the technical conference available to attendees and the free sessions that are open to any registration type.
Alex Stepinski: GreenSource Fabrication Update
Alex Stepinski gives an update on GreenSource, their acquisition of AWP, and their move to full production after some delays. Barry Matties and Alex also discuss automation and the difficulties in hiring in the U.S. and announces the decision to go to market with their recycling equipment in 2020.
Logistics Are Frank Lorentz’s Passion
Recently, Barry Matties had the chance to visit Ventec International Group’s German facility in Kirchheimbolanden (KIBO), where he met Frank Lorentz, Ventec’s general manager for the location. Logistics are clearly Frank’s passion. He lives and breathes it. If you spend any amount of time with him, that is abundantly clear. This interview with Frank was conducted after a tour of the KIBO site.
Visit the Newcomers’ Lounge at IPC APEX EXPO
The Newcomers’ Lounge will open on February 2, will remain open through February 6, and is conveniently located near the technical conference and meetings area, where it will serve as a dedicated resource center for newcomers to get their questions answered and meet other newcomers. Use the lounge to take a break from the hustle and bustle of a busy day, catch up on emails, or grab a quick snack or refreshment.
CES: Sands Show Floor and ShowStoppers
Every year at CES, ShowStoppers and a similar event, Pepcom, demonstrate many new devices and technologies. Again, some will become devices we can’t live without, and some you will never hear about again. Seeing all of these new ideas is one of the highlights of attending CES. Enjoy this look at a potpourri of new, innovative high-tech products.
CES Slideshow: The Future is Now
During the Consumer Electronics Show in Las Vegas, Nevada, the I-Connect007 Editorial Team met with some of the industry's top executives, managers, and engineers. Enjoy this slideshow from CES week.
CES 2020 Automotive: The Future Looks Like a Box
CES week has been true to the themes set forth by Steve Koenig on Sunday, and having spent most of Wednesday in the North Hall of the Las Vegas Convention Center—the automotive pavilion—I can say that Koenig was right: the electric vehicle has reached an inflection point. And along with electric propulsion came autonomous operation.
Ivanka Trump CES Keynote: The Path to the Future of Work
The Palazzo Ballroom at the Venetian Hotel and Casino was the site for one of the most anticipated keynotes at CES on Tuesday afternoon. CTA CEO Gary Shapiro moderated a conversation with Ivanka Trump, advisor to the President of the United States. The two discussed the current state of the workforce, higher education, skills retraining, alternatives to university education, and immigration. These are all topics that have been under discussion within the electronics manufacturing industry for some time now.
CES 2020: Here We Are Again
Here we are again at what is probably the largest and most fascinating technology event globally—CES. It is hard for me to believe that as a post-semi-retirement activity for me, I have been attending and writing about CES for over 20 years. The much progress that has taken place is immense, and the rate of change has also accelerated.
Heading Into 2020 With Isola
Barry Matties recently spoke with Isola’s Travis Kelly, who has moved from acting CEO into the position of president and CEO. Chief Sales and Marketing Officer Sean Mirshafiei also joins the conversation as they share an update on the progress on the company’s new Arizona factory, as well as their views on the markets and technology trends.
What’s the SCOOP: Chinese New Year
Chinese New Year really is an amazing celebration with millions of workers returning to their families for the celebrations. But with the shutdown and mass migration come stress on infrastructure, supply chain and the whole manufacturing and fulfillment ecosystem. I asked a few Industry experts what they thought the key issues are and what advice they’d offer.
Ledia 6 Direct Imaging System Offers Enhanced Speed and Precision
Technical Editor Pete Starkey recently met with Ucamco’s Michel Van den heuvel, imaging product group director, to discuss the benefits of the Ledia 6 direct imaging system, which was introduced earlier this summer and features scan-alignment and improvements in registration and positioning accuracy.
Planning a Successful Technical Conference
Amanda Lange founded DINEvent and has evolved her company into an active events planner and management company with a global client base. In this interview, Nolan Johnson asks Amanda to share how a technology company should get started with a technical conference for customers.
How to Become a Certified IPC Trainer
The Blackfox Certified IPC Trainer (CIT) programs are best suited for experienced and skilled electronics technicians, engineers, and supervisors who have the will and passion to teach and train colleagues about the quality standards of IPC. They also provide successful candidates with a credential that confirms their knowledge and understanding of IPC quality systems.
Wi-Fi 6: Wired vs. Wireless
We all know that it makes no sense to get the latest device just because they come out with a new one every year. Sure, post-millennials tend to want a new phone every year, but most of us are well past that. However, as the competitive nature of the consumer tech industry continues to increase, the rate of change is also accelerating, as is the peer pressure to upgrade. Non-techies get new phones every year, techies get new CPU and GPUs every two years, average consumers get bigger and higher-res TVs every three years, and on it goes.
CIMS Galaxy: More Than an Inspection System
Editor Pete Starkey and Vladi discuss the newest CIMS AOI platform, Galaxy, which is more compact and more versatile than the previous Phoenix model. The Galaxy is scalable and can be equipped with more functions and connected to a variety of Industry 4.0 databases. Vladi explains that the Galaxy can be used for everything from inner layer inspection to final inspection, detecting defects down to 1 pixel. The system is available with multiple metrology options as well.
Decreasing Bend Radius and Improving Reliability- Part III
Application: Design guidelines to improve the flexibility and reliability of flexible circuits. Most issues that arise with flex circuits can be eliminated in the early stages of the design phase, and special planning must occur when the circuit is required to bend. Many novices will design a circuit that calls for bending the flex in too tight of a bend radius, which can cause damage to the circuit and lower the reliability of the end product.
The Viability of a Cyanide-free Immersion Gold Bath
The Tianjin chemical blast in August 2015 sensitized the Chinese authorities to the use of cyanide in production. As a consequence, the authorities have introduced licensing with regard to the use of cyanide. In turn, this has motivated Chinese PCB manufacturers to ask suppliers for a competent cyanide-free immersion gold solution (CNF Au).
A Walking Tour of Viking Test With Jake Kelly
In this video walking tour of the Viking Test booth at productronica 2019, Managing Director Jake Kelly walks us down the line of Viking's universal film stripper.
The ICT 2019 Christmas Seminar
Since 2016, the Institute of Circuit Technology (ICT) has held its northern area Christmas seminar at the Majestic Hotel in Harrogate—the elegant and historic English spa town in North Yorkshire. Pete Starkey provides an overview of this popular ICT event.
Electra Polymers: Inkjet Soldermask is Ready, Reliable and Green
Editor Pete Starkey and Tibbals discuss Electra Polymers’ move into the inkjet soldermask market, and some of the challenges and benefits of this technology. Tibbals explains how inkjet soldermask can enable end-users to improve reliability of the final product, for instance, because this additive process allows manufacturers to control the thickness of soldermask around vias and BGAs and eliminating trapped chemistry in undercut areas.
The CPCA and China’s Electronic Circuit Industry: Past and Future
Wang Longji is the honorary secretary-general of the China Printed Circuit Association. He is a senior engineer and an industry leader and used to be the production manager of the first imported PCB manufacturing line in China. Mr. Wang is also a well-known child actor and a “national treasure;” one of his most famous characters was San Mao in “The Winter of Three Hairs.”
Pluritec Takes Industry 4.0 to the Next Level
Pete Starkey and Pluritec’s Nicola Doria, president and CEO, discuss how the structure of Pluritec has developed over the past few years, now including many respected brand names that are long familiar in the PCB fabrication segment. Doria also explains how the company is continuing its implementation of Industry 4.0 processes.
Industry Set for Shift to True 3D Printing and Photonics
Nolan Johnson sits down with Zach Peterson, owner of Northwest Engineering Solutions, who predicts two things that would challenge the current status quo for the PCB manufacturing industry: true 3D printing and additive, including discretes as well as the substrates and traces, and a completely different approach with photonics.
Nolan’s Notes: Clarity of Vision
In this issue, we update your prescription, clarify your vision of the industry, and bring your own perspective into view. With each interview, try on another outlook and look at the industry from another point of view.
Day 1 Coverage of International Electronics Circuit Exhibition in Shenzhen
The newly named International Electronics Circuit Exhibition, formerly known as the HKPCA Show, kicked off today in Shenzhen, China. This event is now part of a cooperation between the CPCA and HKPCA associations. This is the largest trade show serving the south China region, with 3,537 booths from 621 exhibitors this year.
Conductivity Laminate for High-frequency Applications
Editor Pete Starkey and Vitali Judin discuss how Rogers Corporation has responded to demands for high thermal conductivity combined with low loss in high-power RF applications with the newly launched. The PTFE-based TC350 Plus is capable of handling temperatures above 125°C and draws upon Rogers’ long experience with the TC350 material line-up.
Atotech’s Graphite-based Process and Chemistries Portfolio
Dr. Brüning, global product director, desmear and metallization, and electronics consultant Johan Lundqvist, update Nolan Johnson on the ViaKing graphite-based direct metallization process and explain how it fits in with customer applications. They also discuss Atotech’s portfolio of various chemistries. Johan came to Atotech in August 2019 through the acquisition of J-KEM where he held the position of CEO. Johan stated, “We are pleased J-KEM has joined the Atotech family, as it makes sense for both sides.”
Calumet Electronics and Averatek Team Up on A-SAP
Nolan Johnson talks with Brian Hess of Calumet Electronics and Mike Vinson of Averatek about the new, insertable additive processes that the companies are working on together to help factories running primarily subtractive processes to quickly convert to very high-density interconnect (HDI) features, including trace and space from 2.5-mil line and space to 1-mil line and space and below.
InduBond: Magnetic Induction Lamination
In this video interview, part of the productronica 2019 coverage, we spoke with Víctor Lázaro, R&D manager and technical director at Indubond. Víctor describes Indubond’s innovative methods for heating the boards to effect lamination through magnetic induction. Victor discusses the energy and operational efficiency that an induction method brings to the equipment: thermal profiles.
Future Trends in Flying Probe Testing
Peter Brandt, director of sales for Europe and Japan at atg, sits down with Pete Starkey and Barry Matties, gives his views on market requirements and testing technologies, and explains how flying probe testing is becoming the industry standard at all levels of production—and in many cases, the only practicable solution.
Market Drivers and ESI’s Ongoing Developments
During productronica 2019, the I-Connect007 Editorial Team met with some of the industry's top executives, managers, and engineers.
EIPC Winter Conference—Speakers and Papers
I recently spoke with Kirsten Smit-Westenberg, executive director of EIPC, who is planning the EIPC winter conference set for February 2020 in Rotterdam, Netherlands. Kirsten discusses the conference topics, which are based around the needs of the next-generation electronic devices, and changes in fabrication solutions for PCBs, PCBAs, materials, and technologies.
Sunstone Circuits on Staffing Trends in the Digital Age
Sheri Kuretich, human resources manager, and Nancy Viter, VP of operations, of Sunstone Circuits speak with Nolan Johnson about what they see from the perspective of a prototyping shop, the current state of the hiring market, and how they have used ISO 9000 as an information repository to pass technical knowledge from experienced employees to newer ones.
Decreasing Bend Radius and Improving Reliability- Part II
Many of the issues that arise when using a flex circuit come from a lack of knowledge about how to properly design one, especially when the circuit is required to bend. Many novices will design a circuit that calls for bending the flex in too tight of a bend radius, which can cause damage to the circuit and lower the reliability of the end product. This series of articles will focus on the seven key aspects to consider when designing for maximum durability and maximum “flexibility.”
Industry Wind Vane: Future Development Through the 2019 HKPCA Show
The annual HKPCA Show, which has been renamed the 2019 International Electronics Circuit Exhibition (Shenzhen), will be held from December 4–6 at the Shenzhen Convention and Exhibition Center. This year’s exhibition will be jointly organized by the Hong Kong Printed Circuit Association (HKPCA) and the China Printed Circuit Association (CPCA) and will provide a more efficient business platform for all visitors. The PCB007 China Team interviewed a representative from the HKPCA about the exhibition, the industry’s current situation, and future developments.
Flex Standards Update With Nick Koop
This month, I interviewed Nick Koop—director of flex technology at TTM Technologies, a veteran “flex guy” and instructor, and a leader of several IPC flex standards committees. Nick provides an update for the committees he’s involved with and discusses some of the challenges that he sees as more designers enter the world of flex.
5G is Coming With Quantum-Level Advances and Features
I am sure that, by now, all of you have heard about 5G (the fifth-generation of mobile phone and data communication standards). I am also relatively sure that many of you think that this means neat, new cellphone features, and perhaps more texting and selfie abilities. While that may be true, getting a new cellphone for those reasons would be like getting a new car because you want a different color.
Vertical Conductive Structures, Part 4: Tuning Your Signal Performance
The objective of this article is to demonstrate the possibility of using a stitching element as an alternative to the point-to-point connections that are used with traditional via technology. Point-to-point connections have the best performance in terms of signal integrity (one via less in the connection that distorts the signal). A via is mainly a capacitive element that causes signal loss/ dispersion.
Multilayer Press Technology Using Magnetism to Produce Lamination Heat
A revolutionary concept in multilayer press technology has been developed that uses electromagnetic energy to heat the existing stainless-steel separator plates with a never-before dreamed-of accuracy and precision. The heating and cooling systems—embedded within a robust hydraulic press inside a vacuum chamber design—are controlled using a temperature feedback loop that guarantees perfect fidelity between the press recipe and the press result.
Solder Mask Tack Dry
As a general rule, the tack-dry temperature should be as low as possible; in other words, it should only be as high as necessary. If the temperature is too low, the evaporation rate for the solvent will be to slow, and the solder mask will not dry in a reasonable amount of time. If the temperature is too high, however, the dry time certainly will be excellent, but it could create a solder mask lock-in with repercussions by the developing time.
Catching up With Greg Papandrew
It’s always great to catch up with old friends, and last week, I met with Greg Papandrew, a well-known industry entrepreneur, who I worked with on his first company (Bare Board Group). Greg discusses his new business, Better Board Buying (B3).
Meet George Milad, I-Connect007 Columnist
Meet George Milad, one of our newest I-Connect007 columnists! George’s columns will cover PCB plating, IPC specifications, and more. George is the recipient of the 2009 IPC President’s Award, chairs the IPC Plating Committee, and is a permanent member of the IPC Technical Activities Executive Committee.
Chinese Review: The 2018 NTI-100 Top Global PCB Fabricators
Yonglin Gong, senior engineer, deputy secretary-general of the China Printed Circuit Association (CPCA), and editor-in-chief of CPCA Printed Circuit Information Magazine, takes a look at the NTI-100 data and provides his analysis from the Chinese perspective.
Asleep at the Wheel?
The October issue of SMT007 Magazine considers the current, ever-changing landscape of our industry—a landscape being reshaped by “industrious laziness.” We’re automating manual processes with the intent to make our results better. But, like autonomous vehicle enhancements, human awareness and supervision are required.
Communication, Part 4: The Top 5 Causes of Engineering Delays
In Part 4 of this series on how PCB fabricators and designers can better communicate, Bob Chandler from CA Design and Mark Thompson from Prototron Circuits address the top five causes of engineer delays.
Meet Imran Valiani, I-Connect007 Columnist
Imran Valiani has been in the industry and with Rush PCB for over five years as an account manager. During that time, he has developed a keen and unique understanding of the importance of time to market. Imran has worked with a number of key customers, helping them develop systems and programs to ensure that most productive and fastest time to market possible.
Prototron Receives MIL-31032 and AS9100 Certifications
Kim O’Neil, general manager of Prototron Circuits in Tucson, Arizona, discusses the company’s recent MIL-31032 certification and how this experience prepared them for the AS9100 certification. He also explained why auditing is a good thing for any company’s processes and highlighted some of the areas that the auditors inspected.
Why Designers Need to Be at the SMTA Additive Electronics Conference
In a recent interview, Kelly Dack and Tara Dunn (Omni PCB president and conference co-chair) discussed why designers need to attend the SMTA Additive Electronics Conference. Tara will also be attending and moderating a panel discussion at the conference.
Communication, Part 3: Why Do Board Shops Ask So Many Questions?
In Part 3, Bob Chandler from CA Design and Mark Thompson from Prototron Circuits speak with Steve Williams about the importance of preparing, sending, and receiving comprehensive (and ideally, perfectly complete) design data packages. If you’ve ever wondered why the CAM department asks you so many questions, read on.
Happy Holden Previews His AltiumLive Frankfurt Keynote
I recently sat down for an interview with Happy Holden, who is slated to give a keynote speech at this year’s AltiumLive event in Frankfurt, Germany. Happy gives a preview of his presentation, which is focused on smart factories and automation, and why artificial intelligence might improve PCB design and fabrication in the future.
Future of 'Substances and Materials in Products' Data Exchange Formats as Standards
This article provides a simplified, state-of-the-art description of the data exchange formats for standards covering substances and materials reporting in products and processes. It also reviews existing issues and new challenges shared with end users of the standards and companies represented by their trade associations with some solution proposals they could discuss.
Additive Electronics Conference Set for October 2019 Debut
Kelly Dack and Tara Dunn talk about the upcoming conference "Additive Electronics: PCB Scale to IC Scale" on October 24, 2019, hosted by SMTA in San Jose, California, and why it's an important event for people to attend—especially those involved in the design process.
Chuck Bauer: SMTAI 2019 Founder's Award Recipient
At the recent SMTAI conference and exhibition, Chuck Bauer, Ph.D., senior managing director at TechLead Corporation, received the Founder's Award, a prestigious award given to a member who has made exceptional contributions to the industry and provided ongoing support and service to the SMTA.
Decreasing Bend Radius and Improving Reliability—Part I
Many of the issues that arise when using a flex circuit come from a lack of knowledge about how to properly design one, especially when the circuit is required to bend.
Communication, Part 2: Design Data Packages
The first part of this six-part series highlighted ways that PCB fabricators and designers can better communicate, starting with how to qualify a board shop. In Part 2, Bob Chandler and Mark Thompson talk about the importance of preparing, sending, and receiving comprehensive (and ideally, perfectly complete) design data packages.
SMTA Additive Electronics Conference: Industry Trends
Mainstream PCB manufacturing is often limited to 50-75 microns (mm) line and space. But the electronics industry is evolving quickly. Propelled by the demand for more sophisticated electronics, PCB design is being tasked with finer lines, thinner materials, and smaller via sizes.
New High-speed 3D Surface Imaging Technology in Electronics Manufacturing Applications
Line confocal sensors—and scanners based on them—are used in the imaging of surfaces, transparent materials, and multi-layered structures in various metrology and inspection applications on discrete parts, assemblies, webs, and other continuous products. Line confocal sensors operate at high speed and can be used to scan fast-moving surfaces in real-time as well as stationary product samples in the laboratory.
Standards: Why We Have Them and Live by Them
Have you ever designed a board but received feedback that it couldn’t be manufactured unless changes were made? Or maybe you’ve designed a complex board and sent it to the factory only to find out that the manufacturer didn’t build the board to your expectations? PCBs are becoming more complex, factory options are growing, and expectations for product life cycles are becoming longer.
Communication, Part 1: How to Qualify a Board Shop
In Part 1 of this six-part series for "Fab Fridays," Mark Thompson, CID+, engineering support at Prototron, and CA Design CTO Bob Chandler discuss ways that PCB fabricators and designers can better communicate, starting with how to qualify a board shop.
The Institute of Circuit Technology Autumn Seminar
Meriden has been established as a popular Midlands venue for Institute of Circuit Technology (ICT) meetings. On September 19, a multitude of Fellows, Members, and Associates gathered for the Institute’s autumn seminar, which was organised and hosted by ICT Technical Director Bill Wilkie. The agenda included five informative technical presentations, describing current research and development on significant topics relevant to the industry.
Insertion Loss Performance Differences Due to Plated Finish and Circuit Structure
Data will be presented for loss versus frequency for six different plated finishes commonly used in the PCB industry, and opinions will be offered as to why the loss behavior differs for the different plated finishes and for the different circuit configurations. Because the insertion loss of high-frequency circuits also depends on substrate thickness, circuits fabricated on substrates with different thicknesses will be evaluated to analyze the effects of substrate thickness on insertion loss.
Is It Time to Shake Up Materials Standards?
COO Mark Goodwin and Technology Ambassador Alun Morgan from Ventec International Group describes how they feel current standards do not sufficiently recognize the needs of end customers today with new processes and materials being shoehorned into old standards based on dated ideas of classifications, and how this makes choosing the right material challenging for designers.
SMTAI 2019: George Milad's SMTAI Paper and the IPC ENIG Specification Revision
George Milad, national accounts manager for technology at Uyemura, discusses his paper on changing processes to eliminate nickel corrosion that he presented at SMTAI. He also tells Nolan Johnson about the IPC ENIG specification revision. George is involved in the Revision B acceptance process and shared information on how to get involved with the specification committee as well.
Carrying the Flag
The September 2019 issue of PCB007 Magazine concludes our month-long look at industry standards. We wrap up by "waving the standard" in celebration. Of course, that phrase immediately piques the interest of us wordsmiths. Why, after all, do English speakers use "standard" as a synonym for a flag?
Meet Dana Korf, I-Connect007 Columnist
Meet Dana Korf, one of our newest I-Connect007 columnists! Dana’s columns will focus on IPC-2581 as well as PCB front-end tooling, data quality, DFM processes, etc.
Additive Electronics Conference Set for October 2019
Tara Dunn, president of Omni PCB and I-Connect007 columnist, and Lenora Clark, director of autonomous driving and safety technology at MacDermid Alpha Automotive, discuss what can be expected from the upcoming Additive Electronics Conference in San Jose, California, the impetus and motivation behind the conference, and who can benefit the most from attending.
Weaving Advocacy into E-Textiles
Electronic textiles (e-textiles) – fabrics that have electronics embedded in them to achieve certain functions – are of growing interest in the electronics manufacturing industry, and thus they are of growing interest to the IPC Government Relations team as well.
The Use of Insoluble Anodes in Acid Copper Plating
Soluble anodes have been the staple of the industry for decades, but they require extensive maintenance and generate waste in both copper metal and electrolyte. As plated copper thickness uniformity requirements become more stringent, more and more time will be needed for anode maintenance to ensure the uniformity of the anodic setup.
Robert Feranec: A Lifetime of PCB Design
Robert Feranec, a popular YouTuber and founder of the FEDEVEL Academy, discusses with Andy Shaughnessy the upcoming keynote he’ll be giving at AltiumLive in San Diego, California, and how he's helping people around the world understand and optimize their PCB design processes.
EIPC Summer Conference 2019, Day 2
In this article, EIPC Chairman Alun Morgan provides the highlights of the second day of the EIPC 2019 Summer Conference, which was held in the beautiful city of Leoben in central Austria. He also talks about key points of the numerous technical presentation at the conference.
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