DuPont Interconnect Solutions to Introduce the Pyralux HP Laminate Adhesive System at IPC APEX EXPO 2022


Reading time ( words)

DuPont Interconnect Solutions (ICS), a business within the Electronics & Industrial segment, will introduce the Pyralux HP laminate adhesive system at the 2022 Institute for Printed Circuits (IPC) APEX Exposition to be held in San Diego, California from January 25 - 27, 2022.

In today’s high-performance electronic devices, data consumption continues to stretch the limits across a variety of end-market segments. High-speed signal transfer across the network creates numerous environments where signal integrity is often diminished, resulting in costly issues for end users. These issues are of utmost importance in demanding applications where reliability and high performance are critical for success.

To improve the performance of these devices, DuPont developed the epoxy-based Pyralux® HP laminate adhesive system that combines best-in-class insertion loss performance with increased functionality and processing. This engineered solution was specifically designed for Original Equipment Manufacturers (OEMs) and Printed Circuit Board (PCB) manufacturers to address the needs in high-performance and high-reliability applications in the telecommunications, networking, medical, industrial, military and aerospace markets.

The Pyralux® HP laminate adhesive system possesses robust processability while maintaining excellent electrical performance to optimize signal integrity in demanding and extreme environment PCB applications. This IPC-certified product is available as a sheet adhesive or as a coverlay that is well-suited for a wide variety of multi-layer flex and rigid-flex applications. The Pyralux® HP laminate adhesive system enables processing at lower temperatures, providing PCB designers and producers with an expanded range of applications they can support when using this unique system.

“We are excited to bring this best-in-class laminate adhesive system to our customers as a critical offering in our portfolio of Pyralux® products,” says Andy Kannurpatti, global business director, DuPont ICS Films & Laminates. “The Pyralux® HP adhesive laminate system is another example of why DuPont has been the preferred flexible laminate solution provider for more than 40 years. Our innovation in offering the widest array of PCB construction options is driving device speed and reliability – enabling a range of applications from 5G connectivity to autonomous vehicles,” said Kannurpatti.

Share




Suggested Items

FCT: Powerful Growth in the Flex Segment

08/31/2022 | Andy Shaughnessy, I-Connect007
After the initial impact of the global pandemic led to a somewhat flat 2020, Carey Burkett, vice president of Flexible Circuit Technologies, explains how the company’s growth took off in 2021, positioning it well for industry trends that continue to show great promise in medical, automotive, consumer, and more. In this interview, Carey breaks down the reasons behind the company’s recent success and how R&D, and a new Zhuhai facility, have positioned them for continued growth.

Real Time with… IPC APEX EXPO 2022: Rigid-Flex Specialists

02/17/2022 | Real Time with...IPC APEX EXPO
As flexible circuit specialists growing their world-wide business, Flexible Circuit Technologies is planning to expand its workforce. Chris Clark, senior applications engineer, discusses the company’s 25% growth in the last year, as well as its new plant in Zhuhai, China, which will focus on rigid-flex circuitry. Chris just joined the company in the past year, but he has spent 31 years in the industry wearing whatever hat was required, and he lays out the company’s plans for the next year.

Real Time with… IPC APEX EXPO 2022: High-Tech Rigid-Flex Boards and More

02/11/2022 | Real Time with...IPC APEX EXPO
Jeff De Serrano, president of PCB Technologies for North America, and Editor Andy Shaughnessy discuss Jeff’s current quest to acquire a PCB fabrication facility. Just six months into his new position at PCB Technologies, Jeff explains his plans for the next few years, including the company’s focus on rigid-flex boards and their plans to invest heavily into high-tech substrates and microelectronics assembly.



Copyright © 2022 I-Connect007. All rights reserved.