Rogers to Feature Advanced Materials Technology, Capabilities for Antennas at IEEE AP-S

Reading time ( words)

Rogers Corporation will exhibit at the IEEE International Symposium on Antennas & Propagation (IEEE AP-S) in Denver, CO (Booth #400) on July 12-14.

The IEEE AP-S conference is intended to provide an international forum for the exchange of information on state-of-the-art research in antennas, propagation, electromagnetic engineering and radio science.

Key Rogers’ products being featured include:

Recently introduced Radix™ 3D Printable Dielectrics family of products, with the first available material featuring a dielectric constant of 2.8 and low loss characteristics at microwave frequencies. These printable dielectric materials give radio frequency (RF) designers unprecedented design freedom in creating new components, eliminating the need to consider typical manufacturing design constraints.

Radix 3D Printable Dielectrics are proprietary composite materials designed for the scalable manufacture of gradient index and controlled dk 3D structures, through a scalable, high-resolution printing process for end-use RF dielectric component manufacturing. Rogers Corporation’s first Radix 3D Printable Dielectric material has a targeted dielectric constant of 2.8 and a dissipation factor of 0.0043 at 10 GHz when cured.

MAGTREX® 555 High Impedance Laminates: The first commercially available low loss laminate with controlled and matched permeability and permittivity, enabling antenna designers to expand the trade-space of their antenna design, enabling design flexibility and optimization.

Rogers technical staff will be available to discuss the most demanding applications from Phase Array Radar Antennas, high frequency magneto-dielectric materials, ablative Radome materials, and metallized-shaped/3D ADM dielectric solutions.

Conference attendees can learn about “3D-Printed E-Band Gradient Dielectric Lens for Automotive and Industrial Applications” from Trevor Polidore of Rogers Corporation and Philip Lambert of 3DFortify at the 3D Printed Lens Antennas technical session on Friday July 15th starting at 3:20 p.m.


Suggested Items

The Birth of the Printed Circuit Board

05/23/2023 | Barry Matties and Nolan Johnson, I-Connect007
Every industry has a beginning, and we are lucky to have Rex Rozario here to share the story of how the printed circuit board industry got its start. I-Connect007 chatted with Rex recently about how he became involved with circuit board inventor Dr. Paul Eisler.

EIPC Review: Ultra-high-density Interconnects, Thin-film Resistor Materials

05/10/2023 | Pete Starkey, I-Connect007
It’s been a little while since I first had the opportunity to review an EIPC Technical Snapshot webinar. This excellent series began in October 2020 when our industry was besieged by the COVID-19 pandemic. It has continued successfully as restrictions have lifted and provides an effective channel for the efficient sharing of relevant knowledge that complements the traditional live conferences. The 20th in the series, in December 2022, focused on environmental issues impacting the electronics industry. In early February, EIPC held its live Winter Conference in Lyon and now, by popular demand, the 21st Technical Snapshot fills a slot before the Summer Conference scheduled for mid-June in Munich.

A Quantic Leap into Foils and Embeddeds With John Andresakis

03/29/2023 | Andy Shaughnessy, Design007 Magazine
Andy Shaughnessy talks with John Andresakis about how the merger of resistive foil technologies from Ohmega and Ticer has evolved under the new ownership of Quantic. Andresakis also shares how these materials are finding new applications, especially in the embedded component application space, as the company reaches out to the new generation of PCB designers and design engineers.

Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.