Forensics Uncovers Elusive Defects & Saves PCB Designs


Reading time ( words)

Can something as tiny as a microCSP-packaged device, as shown in Figure 1, be the cause of a PCB design defect or its complete failure? As you can see, this tiny package is as small, or even a bit smaller than the letter “L” in the word “Liberty” that is printed on the dime.

That’s only part of the story. The other part is you and your CM or EMS provider have no clue that’s where the defect lies, and worse, even if you guessed that the micro-CSP-packaged device posed the problem, you couldn’t find it because it is so elusive and so extraordinarily small.

Today, OEMs are increasingly moving toward smaller, more portable products and systems. Most of those used to be larger, desktop models a few years ago. However, with recent advances in electronics technologies, various markets are demanding smaller products and systems with the same or greater functionality than their larger ancestors.

As a result, semiconductor and electronics suppliers are constantly shrinking their products and adding more functionality to comply with market demands. For CMs and EMS providers, it means moving toward smaller form-factor boards populated with such advanced, but smaller component and device packaging as micro-BGAs, micro-CSPs, package-on-package (PoP), 01005s, and others.

Finding the Defect and Saving the Design

Conventional inspection methodologies on the assembly floor include using advanced X-ray and automatic optical inspection or AOI and continue to be at the forefront for most PCB designs.

Yet, because these advanced inspection and analysis systems aren’t able to deliver, a newer form of inspection is making its presence known in our industry. We call the new form forensic analysis.

Read the full article here.


Editor's Note: This article originally appeared in the April 2014 issue of SMT Magazine.

Share




Suggested Items

Getting Involved Earlier in the Test Process

04/18/2022 | Andy Shaughnessy, I-Connect007
At SMTA Dallas, Andy Shaughnessy stopped by the booth for The Test Connection, to find out from Bert Horner why the company has evolved into spending more time educating and consulting with their customers when it comes to testing new designs.

KIC Adds Wave Monitoring Technology to Industry 4.0 Ecosystem for Thermal Processes

04/13/2022 | Andy Shaughnessy, I-Connect007
At the SMTA Dallas Expo, Andy Shaughnessy sat down with Miles Moreau of KIC to discuss the company’s latest offering in wave process inspection technology. Miles also explains how KIC’s early focus on automated real-time process monitoring has enabled them to become a leader in Smart factory implementation.

Real Time with... IPC APEX EXPO 2022: Smart Factories Demand Total Inspection

02/08/2022 | Real Time with...IPC APEX EXPO
Joel Scutchfield of Koh Young America and SMT007 Editor Nolon Johnson discuss the smart factory's need for a total inspection solution that includes SPI, AOI, DPI, API, and KSMART, along with multi-point inspection (SPI, pre, and post) to improve yields. As Scutchfield points out, "Connectivity alone does not equal a smart factory. It's what you do with the data."



Copyright © 2022 I-Connect007. All rights reserved.