Cicor-made Device Honored at Medical Design Excellence Awards


Reading time ( words)

Cicor is pleased to announce that Hocoma AG's therapeutic back training device Valedo has been selected as the Bronze Winner in the General Hospital Devices and Therapeutic Products category of the 18th Annual Medical Design Excellence Awards competition. As a supplier to the winner, Cicor supports Hocoma AG in the development and manufacture of the device. The 2015 MDEA winning products were announced at the 2015 MDEA ceremony held Tuesday, June 9, 2015 in conjunction with the MD&M East (www.MDMeast.com) event at the Jacob K. Javits Convention Center in New York.

The MDEA are the medtech industry’s premier design competition committed to searching worldwide for the highest caliber finished medical devices, products, systems, or packaging available on the market. The awards program celebrates the achievements of the medical device manufacturers, their suppliers, and the many people behind the scenes—engineers, scientists, designers, and clinicians—who are responsible for the cutting-edge products that are saving lives; improving patient healthcare; and transforming medtech.

The 2015 MDEA Juror Panel selected 45 exceptional finalists in 10 medical technology product categories. Products were judged based on design and engineering innovation; function and user-related innovation; patient benefits; business benefits; and overall benefit to the healthcare system. Unlike other design competitions that are merely styling contests, the MDEA jury is comprised of a balance of practicing doctors, nurses, and technicians alongside industrial designers, engineers, manufacturers, and human factors experts.

Share




Suggested Items

Assemblers Play the ‘Revise or Wait’ Game With Designers

06/22/2022 | Nolan Johnson, I-Connect007
Nolan Johnson recently spoke with Duane Benson at Milwaukee Electronics and Screaming Circuits. Duane was pointing out a trend in moving designs into production, which he termed “revise or wait.” This excerpt provides a preview of our exploration of similar topics involving supply chain issues, lead times, and proceeding forward despite the supply challenges.

How Will Emerging Chiplet Technology Affect PCBs?

06/01/2022 | I-Connect007 Editorial Team
In a recent conversation with Ventec’s Alun Morgan, the I-Connect007 Editorial Team discussed, among several topics, semiconductor packaging developments. Industry insiders will know that, when you get Happy Holden and Alun Morgan talking about emerging technology trends, there will be insights shared.

Getting Involved Earlier in the Test Process

04/18/2022 | Andy Shaughnessy, I-Connect007
At SMTA Dallas, Andy Shaughnessy stopped by the booth for The Test Connection, to find out from Bert Horner why the company has evolved into spending more time educating and consulting with their customers when it comes to testing new designs.



Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.