Article Highlights
Meeting the Challenge With Design Reuse
05/13/2021 | Stephen V. Chavez, PCEA
The Top Five Reasons Products Fail EMI Testing
05/12/2021 | Kenneth Wyatt, Wyatt Technical Services
PCB Design Challenges: Designing With DDR
05/11/2021 | I-Connect007 Editorial Team
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/07/2021 | Andy Shaughnessy, I-Connect007
DFM 101: PCB Materials
04/30/2021 | Anaya Vardya, American Standard Circuits

Latest Articles

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

There is, increasingly, a sense of returning to “normal” daily life where I live. Of the state’s population, 35% have been immunized against coronavirus as of this week. Lockdowns are lifted, schools have partially reopened, and even some offices are staffing back up.

Meeting the Challenge With Design Reuse

As project schedules get shorter and budgets get squeezed, project managers and small business owners must constantly look at ways to maximize limited funding and resources. But reusable PCB design IP allows us to investigate ways to potentially shorten design cycle time.

The Top Five Reasons Products Fail EMI Testing

The three top product failures that Ken Wyatt sees constantly in his consulting practice are radiated emissions, radiated susceptibility, and electrostatic discharge. After reviewing and testing hundreds of products over the years, he's come to the conclusion that products fail these tests for five common reasons. Read on!

PCB Design Challenges: Designing With DDR

Longtime signal integrity experts Rick Hartley and Barry Olney join the I-Connect007 Editorial Team for a discussion around DDR and the complications board designers inevitably face when they design for DDR. If, as Rick and Barry explain, the DDR design process is not that much more complicated than that of a typical high-speed board, why does DDR cause design engineers so much grief? Much of this comes down to following the process, running simulation, and not relying on reference designs.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Finally, it’s May. The snow has melted, the flowers are beginning to bloom, and summer is just around the corner. We’re slowly getting back to normal after the craziest year I can remember. And our industry is on the move! This week, we bring you a veritable seafood platter of articles and columns about PCB design, fabrication, and assembly.

Arlon President Discusses Acquisition by EMC

Arlon President Brad Foster updates Nolan Johnson on EMC’s acquisition of Arlon in December 2020. Foster shares the basic structure of the agreement, the long-term stability built into the merger, and outlines how this brings EMC, Arlon and Technica together as a team. Foster also hints at what we can expect to see from Arlon and EMC in the coming months.

Hate PCB Respins? Five Ways to Reduce or Eliminate Respins

Redesigning a printed circuit board is a chore that no one likes. Respins of printed circuit boards cost money, delay the schedule, and just aren’t enjoyable for anyone. Yet, many companies are not taking advantage of available tools that can reduce—and in many cases eliminate—PCB respins.

A Tribute to Dieter Bergman

In 1962, while at Philco Ford, Dieter became the company’s official representative to the IPC. Dieter tag-teamed with his friend and co-worker Gerald Ginsberg on the development of a prolific run of technical publications including a multilayer design standard and the massive binder known as the IPC-D-330 IPC Design Guide. For his standards contributions, Dieter received the IPC President’s Award in 1968, the same year he assumed chairmanship of the IPC Design Committee.

Show & Tell Magazine Now Available on Demand

IPC APEX EXPO 2021 is in the history books now. But as the paperboys used to say in the 1930s, you can still “read all about it” in Real Time With… IPC APEX EXPO 2021 Show & Tell Magazine! It’s all right here in one convenient publication: interviews with award winners, coverage of keynote speeches, show notes from our technical staff, thoughts from IPC Emerging Engineers, and much more

DFM 101: PCB Materials

One of the biggest challenges facing PCB designers is understanding the cost drivers in the PCB manufacturing process. This article is the first in a series that will discuss these cost drivers (from the PCB manufacturer’s perspective) and the design decisions that will impact product reliability.


I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week’s biggest news came in the form of industry briefings—there were a lot of them and the news was universally positive. The news you need to read for this week includes three reports from IPC detailing: the strength and risks in the global economic recovery; a strong EMS book-to-bill ratio; and strong North American PCB sales. Zeroing in on a single company, Apple reported a significant jump in revenue.

IPC-2581 Revision C: Complete Build Intent for Rigid-Flex

With the current design transfer formats, rigid-flex designers face a hand-off conundrum. You know the situation: My rigid-flex design is done so now it is time to get this built and into the product. Reviewing the documentation reveals that there are tables to define the different stackup definitions used in the design. The cross-references for the different zones to areas of the design are all there, I think. The last time a zone definition was missed, we caused a costly mistake.

Why We Simulate

When Bill Hargin was cutting his teeth in high-speed PCB design some 25 years ago, speeds were slow, layer counts were low, dielectric constants and loss tangents were high, design margins were wide, copper roughness didn’t matter, and glass-weave styles didn’t matter. Dielectrics were called “FR-4” and their properties didn’t matter much. A fast PCI bus operated at just 66 MHz. Times have certainly changed.

PCEA Expands in Its Sophomore Year

Andy Shaughnessy recently spoke with PCEA’s Scott McCurdy and Tomas Chester about the organization’s plans for its second year. They explained that they plan to add new chapters and members, especially younger engineers like Tomas.

Benchmarking Your Process Engineering

Mark Thompson has been in bare board fabrication for over 30 years. He is now laying out printed circuit boards at Monsoon Solutions, a high-tech design bureau near Seattle, Washington. With Mark’s extensive hands-on knowledge of PCB manufacturing, he brings a unique perspective to PCB design. In this discussion with the I-Connect007 editorial team, Mark shares what’s important from a process engineer’s point of view, and how to stay on top of evaluating and benchmarking your manufacturing process, along with insights from his new role as a designer.

Isola Releases IS550H Material

Nolan Johnson speaks with Michael Gay of Isola and Chris Hunrath of Insulectro about the release of their new halogen-free, high-thermal reliability material, which they hope fills the gap in the market between epoxies and polyimides.

Alternatives to Simulation

We are living in an age where the demands on electronic product designs are constantly evolving. The IC technology and operating speeds continue to pose significant challenges for teams as they work to develop their products. The increased transistor switching speeds and less forgiving compliance standards make signal integrity and electro-magnetic compliance more difficult to achieve. The status quo seems to have become, “We expect to fail EMC testing.”

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week, we bring you a wide swath of news, columns, and articles from the past week. Altium announced a new cloud platform that connects design stakeholders with users of its Altium 365 environment. Cadence Design Systems has acquired a company that develops computational fluid dynamics technology to help expand its system analysis offerings.

I-Connect007 'Just Ask' Q&A Compilation Available Now

Throughout 2020, we asked you to send us your questions for Happy Holden, John Mitchell, Joe Fjelstad, Tara Dunn, and Heidi Barnes. You all had plenty of questions for these industry experts. The following is a handy compilation of your questions and their answers.

Meet Chris Young, MilAero007 Columnist

Meet Chris Young, one of our newest I-Connect007 columnists! Chris’ columns will take a lighthearted (sometimes humorous) and informative view of the aerospace and defense industry.


IBM Awarded Best Technical Paper at IPC APEX EXPO 2021

Nolan Johnson and Happy Holden speak with Sarah Czaplewski, whose team at IBM won the Best Technical Paper award at this year’s IPC APEX for “Signal Integrity, Reliability, and Cost Evaluation of PCB Interlayer Crosstalk Reduction.”

A Show Full of Opportunities

Looking back to my notes from IPC APEX 2020, I noticed one of my comments: There were so many interesting sessions that I often found myself in the position of choosing between several that I wanted to attend in the same timeslot. This year was not any different in that regard. I am purposely glossing over the fact that I, like many of my friends, missed the camaraderie and opportunity to catch up in person while attending these technical sessions, and I look forward to being able to do that next year.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

I’m sure it’s just me being hyperaware, but I can’t shake it: Mars is where it’s at right now. Is it just me, or do you get the same feeling from the news? There are the Mars rovers—three generations of them still rolling, now—and a drone helicopter winding up for a maiden flight any day now. But that’s not all. There’s SpaceX’s StarShip, rapid-prototyping its way into a manned flight to Mars. And NASA’s whole “return to the Moon” project is simply a shakedown for the U.S. government contractors’ Mars flight hardware, too.

Excerpt—The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 2

A limitation of many 3D optical inspection systems is the cycle time typically associated with processing millions of pixels to reconstruct a full 3D image using data captured from multiple channels. There should not be a compromise between 3D inspection and throughput. A successful inspection deployment should provide oversight for the process, not compromise, interrupt or slow that process.

Overcoming Component Selection and Sourcing Challenges

Most PCB designers know precisely how Captain James T. Kirk felt because we often feel the same way when starting a new design. We are launching into something that we ultimately don't know how it will turn out. We don't know the difficulties we'll face or problems we’ll need to fix. While we can control the design process and use our skills to make reasonable decisions, there are often huge hazards awaiting us in the "unknown." One worsening problem for all designers is component procurement.

Bridging the Simulation Tool Divide

Todd Westerhoff of Siemens EDA recently spoke with the I-Connect007 Editorial Team about the divide between users of high-powered enterprise simulation tools and those who need a more practical tool for everyday use, and how Siemens is working to bridge the gap. Todd also shared his views on why so many engineers do not use simulation, as well as advice for engineers just getting started with simulation tools.

My Thoughts From the Virtual Show

Gosh, I sure missed the live event! I listened in on several technical sessions, the awards ceremony, the keynotes, and the Hall of Fame management session. I tried a couple of professional development courses but got the frownie face on my screen and didn’t go back in. I have almost 90 days(!) to browse them to my heart’s content, so what the heck. There were good points and a few not so good things about this first ever virtual conference. You probably experienced some yourself.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

In this week’s roundup, we have news about a new DFM environment from Siemens EDA, a 2D field solver from Avishtech, and a milestone for the IPC-CFX-2591 QPL. We also have a great article by Calumet’s Audra Thurston, who points out the many advantages of a virtual trade show. And in his latest column, Denny Fritz explains why the DoD is now thinking like many U.S. OEMs—worrying about single-source components, for instance—but the stakes are much higher.

Barry Olney’s High-Speed Simulation Primer

The I-Connect007 editorial team recently spoke with Barry Olney of iCD about simulation. Barry, a columnist for Design007 Magazine, explains why simulation tools can have such a steep learning curve, and why many design engineers are still not using simulation on complex high-speed designs.

Polar Instruments Driven by Customer Demand

Andy Shaughnessy recently spoke with Geoffrey Hazelett, vice president of sales for Polar Instruments, about the virtual IPC APEX EXPO and the eventual return of live trade shows and conferences. They also discussed some of the company’s newest releases, many of which came about through customer demand.


Technical Conference—Balancing Conventional and Disruptive Technologies

I thought the three keynotes given by IPC President and CEO John Mitchell, Industry Week Editor-in-Chief Travis Hessman, and IPC Chief Economist Shawn DuBravac, were spot on. They all spoke to the fact that the way products are conceived, designed, manufactured, and used is changing rapidly. While the keynotes had different focus areas, I noted an important similarity—they all underscored the need for increased industry collaboration to help bring the factory and supply chain of the future to life.

With Flex, Sometimes You Gotta Break the Rules

Sometimes in life, we need to break the rules. For example, in junior high I had a curfew but to have my first kiss, I had to break curfew. I got grounded, but it was worth it! My last article was about reasons to follow IPC design and inspection rules. This time, we are discussing instances where, due to complex requirements, customers are not always able to follow the rules. I will also discuss some design options that will hopefully keep you from “getting grounded.”

Rising Star Award Winner: Radu Diaconescu

Last year’s IPC APEX EXPO, which took place in sunny San Diego, seems to have taken place in a different world. This was a world where talks were held in front of a large crowd, not a monitor, and travelling to the other side of the world wasn’t considered a reckless risk. By February 2020, however, we were starting to grasp the seriousness of the situation. Back then, there were a lot of things that we didn’t know, and more importantly, there were a lot of things that we had no clue that we didn’t know. The concept of “knowing what you don’t know” or figuring out the areas where one lacks knowledge is probably as important as acquiring the knowledge itself.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

The Top 5 is labeled as “editor’s choice,” which is a good thing this week because if I were limited to just posting the five most viewed news items, this week’s list would be full of our own coverage for IPC APEX EXPO. Judging from the metrics, that content has been extremely popular.

Rooting Out an 'Us vs. Them' Mentality: An Interview with Laura Kriska

Earlier this year, I-Connect007 columnist Dan Beaulieu submitted a book review on "The Business of WE: The Proven Three-Step Process for Closing the Gap Between Us and Them in Your Workplace." As a follow up to that review, Dan has interviewed the book's author, Laura Kriska.

Emerging Engineer: Jesse Vaughan

Jesse Vaughan, a member of the IPC Emerging Engineer program, discusses some of the takeaways from this year's virtual IPC APEX EXPO.

Happy’s Play-by-Play of IPC APEX EXPO

This was the first time IPC had a virtual APEX EXPO. It went well, but I missed seeing everyone. On the other hand, all this material being available for 90 days certainly allows it to fit anyone’s schedule. I spent all week intently listening to the presentations.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week, we have a round-up of stories from around the industry, including a Real Time with… IPC APEX EXPO interview with Ventec, an article by Tamara Jovanovic about eliminating “garbage in, garbage out,” a review of an EIPC webinar by Pete Starkey, and news about another trade show going virtual this summer. And last but certainly not least, we bring you our one-minute video salute to all the fantastic people in this industry who we’ve worked with for decades. Enjoy!

Eliminating ‘Garbage In, Garbage Out’ With Checks and Balances

The proverbial saying “garbage in, garbage out” holds true in the electronic product development world. PCB designers stand squarely in the middle of a busy information intersection flowing with inputs and outputs. Missing or bad information at the beginning of a design project will undoubtedly lead to board re-spins, increased costs, and most importantly, a delayed product release. The same can be said about the PCB designer who doesn’t provide a fully checked and comprehensive data package to the downstream manufacturers, i.e., “throwing it over the fence.”

EIPC Technical Snapshot: 5G and Loss Minimisation

Bringing a specialised technical area into sharp focus, this month’s topic was “5G and the understanding of loss minimisation at the PCB level,” with papers on dielectric material, copper foil, and modelling solutions. The webinar was moderated by EIPC board member Paul Waldner managing director of Multiline International Europa, who admitted that he had managed to get a haircut especially for the occasion!


Averatek Offers Updates on ASAP Progress and Online Resource Site

Averatek’s Mike Vinson and Tara Dunn provide an update on Averatek’s ASAP progress. Mike shares the results from his presentation on reliability and signal integrity, while Tara details the newly announced ASAP Community of Interest web resource site.

Turning ‘Garbage In, Garbage Out' into ‘Good In, Good Out’

In the PCB design cycle, it is so easy to unintentionally introduce “garbage” into your system. Unless you have time to extensively check everything you bring in from an external source, it is very likely that something will not match up with your design data. In the end, this means you’ll have to put more work into your design and basically reverse-engineer a part that was supposed to save you time and effort.

Achieving Growth in a Difficult Year: The Benefits of Global Supply Chain Management

Jack Pattie, president of Ventec USA, discusses the growth of the business, the strengthening of the operation, quality system accreditations, the advantages of building close working relationships with OEMs, and how a well-managed global supply chain has overcome some of the challenges and frustrations encountered during the past year.

I-Connect007 Video: A Salute to The Industry

I-Connect007 has produced this new one-minute video to acknowledge nearly 35 years of sharing your stories. In 1987 we launched our first industry publication and we have been dedicated to covering this industry ever since. We did not start out as publishers: in fact, our background was in printed circuit board fabrication. In 1987 there were still nearly 3,000 PCB shops in North America. At the time, profits were goods, trade events included giant industry parties (remember the extravagant hospitality suites in Anaheim?), and the industry was in a state of change.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Last week was “APEX Week” and, unsurprisingly, the most popular news this week was APEX related (with one outlier, of course!) This week, the top five items you should follow lean strongly toward APEX interviews focusing on future trends. Remember, this year APEX offers on-demand access to the papers, presentations, events, keynotes, and forums. You can even register for post-show access.

DownStream Focused on Rigid-Flex and Embedded Component Support

Editor Kelly Dack and Joe Clark, co-founder of DownStream Technologies, discuss trends in PCB design and how this has led to the company's introduction of rigid-flex design support for their tools.

APEX Thursday Keynote: Shawn DuBravac on a Data-driven Tech World

Shawn DuBravac, IPC chief economist, provided Thursday’s IPC APEX EXPO keynote address, “The Tech Industry in a Post-pandemic World.”

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

There was a lot going on in the industry this week, and most of it happened at the virtual IPC APEX EXPO. Sure, it wasn’t the same as being in San Diego, but the show went pretty well, especially for a first-time event. There were a few technical snafus, but the IPC technical staff was responsive and took care of most of the issues right away. As I said a few months ago, how would you like to be in trade show management during a pandemic? So, without further ado, here are my top five stories from the past week.

Elmatica Offers Unique Thank You for Dieter Bergman IPC Fellowship Award

This is how Norwegian PCB broker Elmatica said “thank you” to IPC for selecting Jan Pedersen for the Dieter Bergman IPC Fellowship Award. And you think you've had a cold winter! The Elmatica team definitely has a great sense of humor. Let's all congratulate Jan for his work with IPC, including updating PCB standards and helping to streamline the design data process.

Karen McConnell: Recipient of the IPC Raymond E. Pritchard Hall of Fame Award

"I heard about IPC when I started a new job at UNISYS after graduating college. I moved from ASIC design to printed circuit boards," said Karen McConnell after being inducted into the Raymond E. Pritchard Hall of Fame. "At the time, in the late ’80s and early ’90s, there were rumors going around that printed circuit boards were going to disappear, and ASICs were going to take over the world. But something in printed circuit boards fascinated me. I minored in robotics in college as an electrical engineer and the data used to fabricate, assemble and test the boards is actually all robotic language. I was hooked."


IPC APEX EXPO 2021 Keynote: Travis Hessman on ‘The Great Digital Transformation’

Wednesday’s Premier Keynote at IPC APEX EXPO 2021 came from Travis Hessman, editor-in-chief of IndustryWeek, “a website and magazine dedicated to manufacturing leadership, operational excellence and the technologies that make it possible.” An energetic and animated presenter, a powerful storyteller and visibly passionate about digital manufacturing, Hessman made it clear at the outset that his goal was not to hype an already over-hyped industry, nor to focus on the technologies themselves, but to walk-through the process of transformation.

Bonding Hybrid Multilayer Constructions at Rogers Corporation

John Ekis, Rogers Corporation's market segment director for aerospace and defense, discusses the SpeedWave family of low-dielectric constant, ultra-low-loss prepreg materials with excellent filling and bonding characteristics for hybrid multilayer constructions. SpeedWave prepreg is also compatible with FR-4 fabrication processes and lead-free PCB assembly processing. SpeedWave is available in multiple spread and open weave glass style and resin content combinations, and is also compatible with FR-4 fabrication processes and lead-free PCB assembly processing.

IPC Managers Forum: Packed With Useful Information

Gene Weiner of Weiner International Associates discusses the highlights of the IPC Managers Forum which took place on the first day of IPC APEX EXPO. The forum was filled with a variety of speakers covering a range of industry topics.

IPC Releases Free Smart Factory for Electronics Manufacturing Presentation

The IPC APEX EXPO 2021 Technical Program features a tract on the “Factory of the Future Implementation,” March 10-11. As part of that program, IPC has made available a free presentation and video from the Manufacturing Technology Center (MTC), a CFX Program member. In this presentation, Barry Maybank along with Naim Kapadia, MTC technology manager, explains the background of the MTC, one of seven high-value-manufacturing technology catapult centers established in the UK.

IPC APEX EXPO Keynote: John Mitchell on the State of the Industry

IPC President and CEO Dr. John Mitchell was the Monday keynote for the 2021 edition of IPC APEX EXPO. Delivered via video conference as a part of this year’s virtual format, Mitchell made good use of a panel approach. After opening remarks, Mitchell anchored an around-the-horn series of reports from IPC experts.

The Key to Eliminating Bad Design Data: Constant Vigilance

The I-Connect007 editorial team recently met with Jen Kolar and Mark Thompson of Monsoon Solutions to discuss ways to eliminate bad data from the design process, whether that be from CAD libraries, parts vendors, chip makers, or customers themselves. They key in on some problems and obstacles that allow incorrect data into the design cycle, and then highlight possible solutions.

IPC APEX EXPO 2021: The Complete Agenda

IPC APEX EXPO week kicks off today in a first-ever virtual format. The 24-page IPC APEX EXPO program of courses and conference events details the events, technical program, keynotes, and much more.

Virtual IPC APEX EXPO Kicks Off Today

There will be no long TSA lines, late flights, Uber rides, noisy hotel rooms, missing luggage, or aching feet...all things that we long for. Instead, we will be attending our first-ever online IPC APEX EXPO 2021 starting today. One key benefit with this year’s IPC APEX EXPO is your ability to choose what session you will see or not see, as the IPC will have the sessions available for 90 days after the show so that you can catch up on whatever you missed. Also, those on your team who normally do not travel to the event will now be able to take part.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

A perennial and yet irregular category on the popular game show Jeopardy is “potpourri.” My dad, as I was growing up, pronounced the word as “pot-poury.” It wasn’t until I was a sophomore in college that my girlfriend’s mom—who had a penchant for a soupcon of French euphemism in her tête-à-têtes—pronounced the word properly: “po-pu-ree.” Such are the risks of growing up just a bit rural.

Real Time With… Premium Sponsors Share ‘Top 5 Things You Need to Know’

As part of I-Connect007’s coverage of the IPC APEX EXPO 2021, four premium sponsors share their knowledge and expertise in the following categories.


2020: A Year of Learning, Innovation for Taiyo America

Pete Starkey has a virtual visit with John Fix, director of Sales and Marketing at Taiyo America, where they discuss the changes taking place because of COVID-19 restrictions, and some of the new products Taiyo will be presenting at this year’s IPC APEX EXPO.

EIPC Technical Snapshot: Cleanliness

John Ling’s invitation to the fifth in EIPC’s series of Technical Snapshots was as droll as we have come to expect: “In these confined days of lockdown, and exhortations to stay at home and only go out for exercise, this only exercises the natural inclination to hop on a ‘plane to some sunshine.’ Although not the same as Factor 20, one of our webinars gives a high degree of protection from harmful ignorance, and you do not have to go out in the cold.”

The Magnitude of Stackup Considerations

When I was asked to write about stackup creation, I paused at the magnitude of this subject. It is similar to the framework used to pour concrete cement—you need to get the framework right because the framework has such a big impact on the final outcome. Such is the case with shaping the success or failure of our circuits. In writing the newest training manual due out early this year, I observed that the longest chapter in the textbook was dedicated to this subject.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

We’re seeing an increase in optimism as more people are vaccinated and states under lockdown begin flipping open their shutters. This positive outlook is spreading, albeit slowly.

Altium Introduces New Subscription Model

Andy Shaughnessy chats with Lawrence Romine about Altium’s new subscription model for their Altium 365 platform. They discuss what this means for existing and future Altium customers, and some of the drivers leading to this development, including evolving use patterns among customers during the pandemic.

Predicting a ‘Roaring Twenties’ Innovation Boom

The 2020s have not started as anyone would have wished. The COVID-19 pandemic has exposed weaknesses in supply chains and in global manufacturing, yet this could still be the most innovative decade ever.

Managing Footprints With Integrated EDA Tools

Electronics companies are always under great pressure to continually grow and innovate. In addition to navigating ever-accelerating design cycles, they must also address and overcome generational complexities associated with their products, the underlying components they use, and the human capital accountable for delivering on time and on budget. Electronics firms can ill afford the time and resource inefficiencies associated with manually correcting design errors, poor library data integrity, or other inconsistencies leading to missed deadlines or even costly re-spins.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

I’m following the landing procedures for NASA’s Perseverance Mars lander as I’m finishing my Top 5 list for the week. The successful landing of the lander seems a nice highlight for this week. Our global aerospace programs, both national and private enterprise, make these missions seem almost, almost routine. They are, as we all know, anything but routine. No surprise, then, that aerospace-related news percolated to the top of mind for our readers this week.

Footprints: A Distributor’s Perspective

No issue on footprints and library management would be complete without input from a component distributor. I recently interviewed Geof Lipman of Octopart; as director of operations for part data, he’s one of the brains behind the entire site. Geof explains how Octopart functions and manages millions of component data points, and he also discusses the current landscape of electronic components.

A Library Management Cautionary Tale

The library management of footprints, land patterns, or cells—however you refer to them in your ecosystem—is one of the most critical items in the foundation of any PCB or CCA design. When I was asked to write an article on this topic, so many thoughts and experiences instantly flooded my mind. After 30+ years of designing PCBs throughout the industry, I have my share of experiences and stories about footprints. One particular experience stands out.


I-Connect007 Editor’s Choice: Five Must-Reads for the Week

We’re moving on into 2021, and there’s quite a bit going on in the world of PCB design, fabrication, and assembly. IPC APEX EXPO is fast approaching, and I know a lot of you will be attending, albeit virtually. In this week’s Top Five, columnist Eric Camden provides a how-to guide for PCBA technologists planning their IPC APEX EXPO schedule.

We Are Stronger by What Unites Us

PCEA President Stephen V. Chavez and SMTA Global Executive Director Tanya Martin co-wrote this letter to the editor in response to a recent PCB007 column.

Best Practices: Footprint Design and CAD Library Management

The I-Connect team spoke with Altium’s John Watson about the hurdles surrounding footprints and footprint design. John talks about how being proactive and improving the CAD library can better QC processes and help protect against footprint difficulties.

Joe Fjelstad's Book Review: The Innovators

"The Innovators: How a Group of Hackers, Geniuses, and Geeks Created the Digital Revolution" by Walter Isaacson is the best technology history book I have ever read, and at the same time one of the most engaging and entertaining. It is a forte of Isaacson to write biographies of great people. I have read his other books on DaVinci, Steve Jobs, Ben Franklin and Albert Einstein and found them equally brilliant. Isaacson has a number of other titles I have yet to get to in the future. He is a singularly great storyteller.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Another active news week in the electronics industry! February is launching with a high-G burn, to be sure. And if you’re a fan of The Expanse, like I am, then you’ve probably already watched through to the Season 5 finale; this means you have attention to spare for industry news all of a sudden. And if you haven’t reached the current end of the line for The Expanse, then today’s list is just what you need while you catch up.

Catching up With Nano Dimension

Dan Feinberg spoke with Valentin Storz, Nano Dimension’s general manager of EMEA and director of marketing, about how the pandemic has affected their business this past year and what they have planned moving forward.

Wild River ISI-56 Platform Accelerates SerDes Testing

I recently spoke with Al Neves, founder and CTO of Wild River Technology, about the release of their new ISI-56 loss modeling platform. Al explains why it was so critical that this tool meets the stringent requirements of the IEEE P370 specification (which he helped develop), and why he believes this is currently the best tool for SerDes testing and characterization.

Seven Tips for Your Next Stackup Design

Rarely do we have the luxury of designing a board just for connectivity. When interconnects are not transparent, we must engineer them to reduce the noise they can generate. This is where design for signal integrity, power integrity and EMC—collectively high-speed digital engineering—are so important. Eric Bogatin offers seven tips for stackup design.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week, we have a variety of news and articles to share, and it’s all positive. We have a new president, and he’s pledging to help American businesses. December PCB sales were up 4.5% over the same period a year ago. Atotech is just about ready to launch an IPO. Sunstone has tweaked its free CAD tool, PCB123, to make it even easier for designers to receive their Gerber files. And columnist John Watson breaks down what we all learned during the chaos that was 2020.

Book Review: The Timeliest Read of 2021—The Business of WE

It’s only January, but this may be the timeliest book of the year, as well as the most important. Why? Because it deals with the issues that we are facing right here now. The gap that Kriska refers to is the one between black and white, men and women and as the title suggests “we and them.”


IPC’s Alicia Balonek Talks Trade Show News

Nolan Johnson discusses IPC APEX EXPO 2021 with Alicia Balonek, senior director of trade shows and events at IPC. Alicia provides an update on how IPC APEX EXPO will be structured in a virtual format, overviews the programming changes, and new additions designed to make IPC APEX EXPO the best virtual event possible.

Book Excerpt: ‘Thermal Management: A Fabricator's Perspective,' Chapter 3

Conceptually, a metal-core board is exactly like it sounds—the metal is in the middle of the PCB sandwiched between layers on both sides. Just about any PCBA that will contain active heat-generating components can benefit when designed on a metal-core PCB. On a conventional PCB, the standard FR-4 layers are relatively poor thermal conductors, and heat is normally dissipated from active components using vias and thermal pads, as discussed earlier.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week’s news gave off every indicator that we’ve started a new calendar year. The news channels were busy with changes in leadership—both corporate and governmental—and changes in ownership. Changes in representation, too. Honestly, it was hard to sort out the news to just five top items. Be that as it may, here are five things we think you ought to read, even if you read nothing else about the electronics manufacturing industry this week: tradeshow coverage, strategic acquisitions, market discussion, and governmental advocacy.

Tech 2 Tech: KYZEN’s Short Technical Sessions a Big Hit

Nolan Johnson gets an update from Tom Forsythe on KYZEN’s Tech 2 Tech sessions. These brief 15-minute sessions were set up during the pandemic by KYZEN for customers, prospects, and new engineers around cleaning, and have since found traction with their manufacturers, reps and distributors.

Your Greatest Competition is Yourself

It really doesn’t matter who you think your external competitors are, because the only competitor that really matters is you. Of course, you will look externally to stay on top of latest trends, but when it comes to competition, just competing with yourself is a win. When you look at yourself as your greatest competitor you will start with a huge advantage: you already have great intel on how “your competition” thinks. Ask yourself, “What can I do to displace my ‘competitor’ and create something much better?”

What’s Driving Price Increases for CCL and Prepreg?

Demand for copper foil is increasing from both PCB and battery production for e-mobility, leading to an upward price pressure for copper foils as post lockdown pent-up demand starts to exceed capacity. Lead times are stretching and prices increasing, particularly for heavy copper foils (2 oz./70 micron and above) as capacity is repurposed to maximize square-meter output for lightweight foils to increase capacity for lithium battery production.

Book Excerpt: Thermal Management With Insulated Metal Substrates, Part 5

The following is an excerpt from Chapter 5 of "The Printed Circuit Designer's Guide to... Thermal Management With Insulated Metal Substrates," written by Ventec International Group’s Didier Mauve and Ian Mayoh. In this free eBook, the authors provide PCB designers with the essential information required to understand the thermal, electrical, and mechanical characteristics of insulated metal substrate laminates.

MivaTek’s New Technology and Market Drivers

I recently spoke with Brendan Hogan about the upcoming new product releases from MivaTek. The conversation flows naturally from the new product’s market drivers to the X=Xc – 1 idea that is at the core of the market drivers.

Just Ask Heidi Barnes: The Exclusive Compilation

We asked for your questions for Keysight Technologies' Heidi Barnes, and you took us up on it! We know you all enjoyed reading these questions and answers, so we’ve compiled all of them into one article for easy reference. We hope you enjoy having another bite at the apple.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Hard to believe that a year ago, I was getting ready to attend DesignCon and IPC APEX EXPO and wondering if this Novel Coronavirus was going to cut into attendance from the Pacific Rim. Now, we’re accustomed to virtual trade shows. They’re not ideal, but they’re the best we can do while meeting in person is not possible. We’ve learned to adapt.


My View from CES 2021: Day 1

What a difference a year makes. One year ago, those of us who cover and attend CES were going from one press conference to the next; this year, we are at home going from link to link. Confusing and challenging, yes, but there are some advantages: no masks, only five steps to get to a restroom, being able to have three of four events or more displaying on your screens at the same time and being able to download press kits as needed. So far, many new devices are being introduced, but of course, they are all online, so you wonder if some of them really exist or are truly operational as yet.

TTM’s Approach to Stackup Design: Train the Customer

In this interview with the I-Connect007 Editorial Team, TTM’s Julie Ellis and Richard Dang drill down into stackup design, detailing some of the common stackup challenges that their customers face when designing for both prototype and volume levels, and offering advice to designers or engineers who are struggling with stackup issues. They also discuss why having too many different prepregs in a stackup can be asking for trouble, and how proper stackup design can optimize both the fabrication and assembly processes.

CES Dispatches: Opening Day at Pepcom

On Monday, January 11, I attended the launch of the CES 2021. Well, more precisely, I attended the Pepcom program, one of the multitude of ways to connect with CES in the virtual environment. Pepcom is a regular at CES, functioning a bit like a show-within-a-show.

CES 2021: Just How Different Will It Be?

CES 2021 starts today and this year there is no need for an overpriced hotel room in Vegas, no long lines to get a taxi or board a bus, and no crowded exhibit halls (one good thing this year). On the other hand, you must decide ahead of time what you want to see and make a reservation or appointment if you wish to have time and access assured.

Just Ask Heidi: Winning NASA’s Silver Snoopy Award

First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, Eric Camden, John Mitchell, and Tara Dunn in our “Just Ask” series. Now, it’s Heidi Barnes’ turn! Today: the ins and outs of NASA's Silver Snoopy Award.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It’s a new year, and time for new resolutions and new beginnings. “New year, new you” certainly is reflected in this past week’s news. We saw several announcements regarding mergers, acquisitions, and organizational changes, plus some government legislation to help kick off the new year. Based on viewing activity, readers were keen to keep up on the changes under way.

Cutting Respins: Journey to the Single-spin PCB

PCB design is more than a short sprint to the finish line; it is a journey best suited for the prepared adventurer. According to a study by Lifecycle Insights, the average PCB design project requires 2.9 respins. These respins can cost anywhere from tens of thousands to millions of dollars—each! As an engineer/business owner, I find respins frustrating because I would rather spend my time and money applying scientific principles inventing, improving technology, and solving problems. I am not an advocate for perfectionism, but rather I focus on becoming a better adventurer. Sometimes I get to taste the sweet wine that is a single spin PCB. As fellow adventurers, let’s discuss some topics that influence unnecessary return trips on our PCB design journey: simulation, technical reviews, and interest in PCB design.

Just Ask Heidi: Is China Still Far Ahead of the U.S. in EE Graduates?

First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, Eric Camden, John Mitchell, and Tara Dunn in our “Just Ask” series. Now, it’s Heidi Barnes’ turn! Today's question: Is China still graduating far more EEs than the U.S.?

IPC CEO and President John Mitchell Discusses New Membership and Dues Structure

In this video, IPC CEO and President Dr. John Mitchell discusses the organization’s move from a site-based and enterprise membership dues structure to a company revenue-based model. Mitchell explains that this change will go into effect upon each member company’s renewal in 2021, and he points out that many of the existing member discounts will remain unchanged.

Just Ask Heidi: The Most Rewarding Part of the Job

First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, Eric Camden, John Mitchell, and Tara Dunn in our “Just Ask” series. Now, it’s Heidi Barnes’s turn! Today: the most rewarding part of a design engineer's job.


Just Ask Heidi: The Biggest Challenge for Design Engineers?

First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, Eric Camden, John Mitchell, and Tara Dunn in our “Just Ask” series. Now, it’s Heidi Barnes’s turn! Today's question: What is the biggest challenge for PCB design engineers right now?

I-Connect Editor’s Choice: Five Must-Reads for the Week

We always hear that the PCB industry is “mature,” full of people past their prime who don’t know how to change with the times. I think 2020 puts the lie to that idea. I’m honored to be a journalist covering such an amazing group of people. In the words of U2, “I will begin again.” Happy New Year!

I-Connect007 Wishes You a Happy New Year

Could there be a more welcome year in recent memory than 2021? If there’s one thing most of us can agree on, it’s that we want 2020 squarely in our rearview mirror as we speed ahead with a fresh, new start. This past year has brought with it much reflection, change and even some consternation. Thank you for taking this journey with us!

Just Ask Heidi: Attracting New Designers and Engineers

First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, Eric Camden, John Mitchell, and Tara Dunn in our “Just Ask” series. Now, it’s Heidi Barnes’s turn! Today's question: How can we attract more young designers and design engineers to this industry?

Chapter 1 Excerpt: The Printed Circuit Assembler’s Guide to Process Validation

The original principle underlying the IPC’s ionic cleanliness requirement was that the mobility of surface ions, detectable from SIR measurements, would correlate to a maximum value of detectable ionic elements permissible on the circuit surface. The industry required a test that was both fast and accurate for process control. Thus, a simplified ion chromatograph that was able to detect ionic elements without differentiation was created.

Happy Holden Discusses His Favorite Career Moment

Managing Editor Nolan Johnson recently buttonholed Happy Holden and asked him to discuss the favorite moment of his career. To know Happy is to understand the full weight of his quiet influence on this industry. We’re delighted to share with you Happy’s reminiscence about spending time with his family at David Packard’s ranch while re-engineering the tank controls at the Monterey Bay Aquarium. As Happy explains, Packard may have been a billionaire and an ex-secretary of defense, but he still cleaned all of the fish that Happy’s kids caught on the ranch.

Lee Ritchey on Reducing Respins by One

I-Connect007 recently spoke with Lee Ritchey about the subject of continuous improvement with a focus on DFM, specifically looking at the benefits of reducing the number of respins by just one. A longtime instructor and one of the authors of Right the First Time: A Practical Handbook on High-Speed PCB and System Design, Lee has spent decades preaching the value of solid DFM practices, so we asked him to discuss why so many OEMs accept multiple respins with each design project and what designers could do to eliminate just one spin. He also shares some of the lessons in reducing respins that he learned in the early days of Silicon Valley.

Just Ask Heidi: Is Power Integrity the Hot Discipline of the Future?

First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, Eric Camden, John Mitchell, and Tara Dunn in our “Just Ask” series. Now, it’s Heidi Barnes’s turn! eidi has been awarded five patents and a NASA Silver Snoopy award (each Silver Snoopy pin flies on a space mission first), and she was named DesignCon's 2017 Engineer of the Year. We hope you enjoy “Just Ask Heidi.”

EIPC Technical Snapshot: PCB Surface Finishes

For the third in a series of Technical Snapshot webinars, EIPC chose to focus on PCB surface finishes, comparing specific properties, examining corrosion behaviour and discussing selection criteria for low-loss, high frequency applications.

John Watson Discusses His Favorite Career Moments

As we celebrate the holidays after a tumultuous year, it’s important to remember all of the good things in our lives. In this short video, Altium’s John Watson discusses a few of the moments that really stand out in his career: earning his IPC Certified Interconnect Designer credentials and designing his very first circuit board.


Happy Holidays from I-Connect007

The I-Connect007 team would like to wish you and your loved ones the happiest holiday season. Continue to stay safe and healthy as we head into 2021. Happy Holidays!

Just Ask Heidi: Eliminating EMC Failures

First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, Eric Camden, John Mitchell, and Tara Dunn in our “Just Ask” series. Now, it’s Heidi Barnes’s turn!

IPC Addresses Critical Industry Skills Gaps With Electronics Workforce Training

Over the past three decades, IPC standards and certification programs have played a critical role in protecting public safety and promoting excellence by ensuring the quality, reliability, and consistency of electronic products. In 2019, IPC worked with its global network of certification centers to certify over 108,000 individuals across 200 countries and 21 languages to seven IPC standards. The ubiquitous adoption of these programs speaks to the strong partnership forged between IPC and the electronics industry.

Chapter 2 Excerpt from the Book ‘Thermal Management: A Fabricator's Perspective’

Insulated metal PCBs (IMPCB) or metal-clad PCBs (MCPCB) are a thermal management design that utilizes a layer of solid metal to dissipate the heat generated by the various components on the PCBs. When metal is attached to a PCB, the bonding material can either be thermally conductive but electrically isolative (IMPCBs or MCPCBs), or in the case of RF/microwave circuits, the bonding material may be both electrically and thermally conductive. The reason that RF designers usually have the bonding material thermally and electrically conductive is that they are using this not only as a heat sink but also as part of the ground layer. The design considerations are quite different for these different applications.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Some years, the middle of December is marked by a distinct lack of news in PCB design, fabrication and assembly. Much of the industry often takes off around this time to get a head start on the holidays, or to squeeze in a much-needed vacation. But 2020 is not one of those years. Most of us aren’t traveling anywhere farther than the refrigerator this year, and everyone seems to still be working, albeit from their home offices. And companies in the PCB community continue to make news.

Cadence’s Celsius: Don’t End up Holding the Hot Potato!

I was just thinking about the party game Hot Potato. It reminded me of today’s increasingly competitive marketplace: Accurate thermal analysis must be performed, and any potential issues have to be identified and addressed as early as possible in the design cycle. Otherwise the system will run into problems, market windows will be missed, and someone will be left holding the hot potato. Trust me, you do not want to be that someone.

Dr. John Mitchell on IPC APEX EXPO Going Virtual

On Monday, December 14, 2020, Barry Matties and Dr. John Mitchell, IPC president and CEO, discussed last week’s decision to move IPC APEX EXPO to an all-virtual platform. In this interview, Dr. Mitchell confirms that IPC is committed to delivering a cutting-edge experience, including a strong technical program, exhibitor and visitor support, multiple keynotes and a wide variety of online networking events. Matties and Mitchell also analyze the challenges for IPC in hosting the show, as well as some of the unique opportunities that a virtual show presents for IPC and attendee alike.

Happy Holden: ECWC15 Virtual Event a Success

This is the first Electronic Circuits World Convention that I have not attended in person since 1978. To refresh your memory, these are held every three years on a rotating basis. The HKPCA hosted this year’s conference and they kept up the fine tradition of collecting outstanding keynotes, nearly 60 technical presentations and myriad poster papers. HKPCA was also kind enough to provide English slides and translations. It is still possible to sign up and view the presentations. I have listened to 20 of the presentations, and hope to attend even more in the coming days as they are all worth watching.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week’s mainstream news was dominated—well, my personalized online news feed was, at least—by ballistics. SpaceX was in the news daily for lobbing multiple pieces of iron, even as their CEO took his household suborbital, leaving California and touching down in Texas. Pandemic numbers charts continue their skyward trajectory worldwide. The ever-present military tests and technology demonstrations, seemed a bit more commonplace this week as well. Worldwide political news, in general, seemed to follow parabolic curves like an Australian boomerang, veering off in unexpected ways only to suddenly cut a curving path and return.

Book Excerpt: Thermal Management With Insulated Metal Substrates, Part 4

The following is an excerpt from Chapter 4 of "The Printed Circuit Designer's Guide to... Thermal Management With Insulated Metal Substrates," written by Ventec International Group’s Didier Mauve and Ian Mayoh. In this free eBook, the authors provide PCB designers with the essential information required to understand the thermal, electrical, and mechanical characteristics of insulated metal substrate laminates.


Oops, I Did It Again: Survey Details Most Common Design Errors

We hate to admit it, but even the best of us make mistakes. Such is true with PCB designers and design engineers. We wondered: What are the most common mistakes that PCB designers make? Michelle Te has more.

Understanding MIL-PRF-31032, Part 6

Concluding this six-part discussion on understanding the military printed circuit board performance standard MIL-PRF-31032, Anaya Vardya the remaining procedure required to address the unique requirements of the military.

Chapter 1 Excerpt from the Book ‘Thermal Management: A Fabricator's Perspective’

Heat cannot be efficiently exchanged with stagnant air surrounding a hot device; however, it can be transferred away from the electronic component to the PCB using thermal vias. A thermal via is a good conductor of heat that runs between the top layer and bottom layer of the PCB, dissipating heat through simple conduction. In simple terms, thermal vias are plated holes located under, or electrically connected to, a surface-mounted heat source on a PCB that allows heat transfer through the hole.

ECWC15 Virtual Conference Keynote: 5G PCB Technology and Material Challenges

The second day of the Electronic Circuits World Convention began with a keynote from Dr. Shiuh-Kao Chiang, managing partner of Prismark, describing the PCB technology and material challenges presented by the introduction of the fifth-generation cellular wireless communication network—the roll-out of which was continuing in spite of the coronavirus pandemic. Technical Editor Pete Starkey has more.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Around the holidays, we often see a slowdown in PCB design and manufacturing news. But this holiday season, there’s been no rest for the newsmakers in our industry! In the last week, our daily and weekly newsletters have been chock-full of breaking news and up-to-the-minute technical information that readers like you rely upon every day.

Cadence’s Clarity: 'I Can See Clearly Now'

Do you recall the song “I Can See Clearly Now”? This catchy tune was first released by Johnny Nash in 1972, which was three years before I started my BSc in Control Engineering at Sheffield Hallam University, Yorkshire, England. I’ve just been looking at the Clarity 3D Transient Solver from Cadence, so the lyrics I’m hearing in my head are, “I can see clearly now the EMI is gone / I can see all EMC obstacles in my way..."

Just Ask Tara Dunn: The Exclusive Compilation

We asked for you to send in your questions for Averatek’s Tara Dunn, and you took us up on it! We know you all enjoyed reading these questions and answers, so we’ve compiled all of them into one article for easy reference. And if you’d like to hear more from Tara, be sure to view her Flex007 column series “Flex Talk.”

Stephen Chavez and Happy Holden on Designing Reliable Vias

Andy Shaughnessy and Happy Holden speak with Stephen Chavez, a staff engineer with an aerospace company and chairman of the Printed Circuit Engineering Association (PCEA), about designing vias for greater reliability. They also address several areas where they can look to improve reliability, a variety of steps that designers should take to help ensure more robust vias, and some testing and educational resources that PCB designers and design engineers should be aware of.

Use of IMS Thermal Materials in Multilayer Stackups for Power Applications

This roundtable discussion brings together the expertise of Ventec International Group’s Global Head of IMS Technology Chris Hanson and Technical Manager Denis McCarthy. Rax Ribadia of Excello Circuits provides hands-on fabrication experience from a specialist PCB manufacturer, and I-Connect007 editors Andy Shaughnessy and Pete Starkey contribute to a conversation that explores applications, materials, design considerations, and mechanisms of heat transfer.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Well, it’s the last Friday in November. On any normal year in the U.S., this would be “Black Friday” because, for many retailers, the kickoff to the holiday season’s shopping spree is the source for most of the operating income for the year. While it remains to be seen how exactly how much traditional in-store and online retailing will rake in, with the varied pandemic lockdowns, it’s clear that readers wanted to get the latest electronics industry sales numbers!


Lee Ritchey Discusses His ‘Homemade’ NASA Board

In this audio interview, Lee Ritchey shares a story about his favorite PCB design—a board that he built on his kitchen table early in his career for a radio used on the Apollo 11 spacecraft. Lee explains how he ended up working on this design as a young engineer, as well as the excitement that he felt watching Apollo 11 land on the moon while carrying his PCB. He also jokes about why his wife was less than pleased with his handiwork when he drilled holes in the board on the kitchen table.

Our Thanksgiving Wish

As we take time to observe this holiday, the I-Connect007 team wishes to offer our thanks to you, our global readers and contributors: designers, fabricators, engineers, assemblers, quality and process control gurus, chemists, physicists, supervisors, managers, entrepreneurs, business owners, standards writers, industry experts, and more. You breathe life into the vital, thriving, world-changing electronics industry. You are the real story.

Catching up With QCMS General Manager Rick McAnally

Founded in 2007, QCMS is one of the more interesting EMS companies on the East Coast. They are actually a sister company to Niche Electronics located in Pennsylvania. Dan Beaulieu interviews QCMS General Manager Rick McAnally.

Mentor’s User2User Conference Focuses on Semiconductor Development

Mentor conducted its annual User2User Conference virtually this year on November 10. In a departure from past U2U conferences, this event was focused primarily on developing semiconductor advances. Happy Holden reports on all the details.

PC Technological Advances in 2020

With CES quickly approaching, which is perhaps the largest technology event globally that is also going virtual this year, key component and sub-assembly companies are not waiting to announce their next generation of components. Dan Feinberg details new components and performance advances, as well as why you should consider building your own PC.

I-Connect007 Editor's Choice: Five Must-Reads for the Week

In my top five picks, we have news about columnist Tara Dunn moving to Averatek to work with their A-SAP additive processes, and an interview with Audrey Sim regarding the “hybrid” model adopted by the HKPCA for its upcoming Electronic Circuits World Convention. We also have a compilation of the questions that readers have asked Joe Fjelstad and news about DownStream Technologies adding support for flex, rigid-flex, and embedded component designs. Finally, we share a review of some of KYZEN’s new training sessions on cleaning electronic assemblies—virtual courses that pack a lot of information into 15-minute snapshots. Knowing how tight everyone’s schedules are now, 15-minute events might be the ticket.

Just Ask Joe Fjelstad: The Exclusive Compilation

We asked for you to send in your questions for Joe Fjelstad, and you took us up on it! We know you all enjoyed reading these questions and answers, so we’ve compiled all of them into one article for easy reference. We hope you enjoy having another bite at the apple. And if you’d like to hear more from Joe, view his column series “Flexible Thinking.”

Part 11 of Siemens’ Digital Twin Webinar Series: Data-Driven Manufacturing

I-007e Micro Webinars recently released a free, on-demand series titled “Implementing Digital Twin Best Practices From Design Through Manufacturing” with Siemens' Jay Gorajia. In Part 11, Gorajia discusses, “Data-Driven Manufacturing: Making Big Data Into Smart Data.”

I-Connect007 Editor's Choice: Five Must-Reads for the Week

My last turn to select the top five editor’s picks was just before the triple-threat Halloween holiday (full moon, blue moon, and on a Saturday). Now that it’s my turn again, it falls the mega-superstitious Friday the 13th. You’re not triskaidekaphobic, are you?

Just Ask Tara Dunn: What Is the Thickest Flex Layer Available?

First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, John Mitchell, and others in our “Just Ask” series. Now, it’s Tara Dunn’s turn! Today's question: What is the maximum thickness of a single flex layer?


Manufacturers Weigh in on Made-in-America Debate

As the U.S. grapples with who will take the helm of the U.S. presidency, electronics manufacturers around the country are grappling with which policies and ideas would promote growth and innovation in the sector. Many agree that a push for “made in America” policies and incentives might be useful. Often, they point to similar initiatives used by other countries, including China and India.

Just Ask Tara Dunn: Why Don’t Fabricators Provide More Feedback to Designers?

First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, John Mitchell, and others in our “Just Ask” series. Now, it’s Tara Dunn’s turn! Tara is the vice president of marketing and business development for Averatek. A regular Flex007 columnist, Tara discusses flexible circuits, rigid-flex, and rigid PCBs, as well as RF/microwave technology, microelectronics, and additive processes. She is also co-founder of Geek-a-Palooza and a show manager for the SMTA Additive Electronics TechXchange event. She has over 20 years of experience in the PCB industry. We hope you enjoy “Just Ask Tara.”

This Month in Design007 Magazine: HDI Design, Landless Vias, VeCS, and More

Andy Shaughnessy, Happy Holden, and Dan Feinberg recently met with James Hofer, general manager of Accurate Circuit Engineering, to discuss via design techniques and via reliability from the fabricator’s viewpoint. As Hofer explained, even with open lines of communication between the designer and the board shop, there are plenty of variables to contend with regarding proper via design, especially when working with PTFE materials.

Roundtable Discussion: App Notes and Fab Notes

Andy Shaughnessy recently invited four recent contributors—Dana Korf, Jen Kolar, Mark Thompson, and Kelly Dack—to review the June and August 2020 issues of Design007 Magazine, which covered app notes and fab notes, respectively. In this wide-ranging roundtable, the group discusses some of the ongoing challenges related to incomplete and inaccurate design data and why communication can preclude many of these problems. What follows is the transcript from this conversation.

I-Connect007 Editor's Choice: Five Must-Reads for the Week

This past week, we published a variety of articles, interviews, and columns—and readers definitely made their favorites known. There was good news about hiring and staffing. (In case you were wondering, there are quite a few open positions in this industry right now.) We touched base with a pair of young engineers to get their thoughts on what it’s like for recent grads working in the PCB manufacturing community. We learned about a company’s new program that can help take some of the stress out of NPI. We also launched a new chapter in our “Just Ask” series, this time starring columnist Tara Dunn. And there was sad news that a contract manufacturer’s chairman had just passed away.

Just Ask Tara Dunn: DFM for Flex and Rigid-Flex

First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, John Mitchell, and others in our “Just Ask” series. Now, it’s Omni PCB President Tara Dunn’s turn! A regular Flex007 columnist, Tara discusses flexible circuits, rigid-flex, and rigid PCBs, as well as RF/microwave technology, microelectronics, and additive processes. Tara is the co-founder of Geek-a-Palooza and a show manager for the SMTA Additive Electronics TechXchange event. She has over 20 years of experience in the PCB industry. We hope you enjoy “Just Ask Tara.”

Real Time with… AltiumLive 2020: Event Wrap-Up With Judy Warner

Andy Shaughnessy and Judy Warner, director of marketing and community engagement for Altium, discuss the recent virtual AltiumLive events and what the company—and the PCB design community—have learned from the uncertain times of 2020.

Real Time with… AltiumLive 2020: OSV Project—From Zero to Ventilator PCBs in Record Time

Andy Shaughnessy recently spoke with Chris Denney, CTO of Worthington Assembly, about his role in the Open Source Ventilator project, which he discussed during a panel at AltiumLive with partners Dugan Karnazes of Velocity Research and Rob Cooke of Calumet Electronics. Chris explains how many of the normal hurdles disappeared once the focus on revenue was removed from the equation, and the ventilator PCBs were designed and manufactured in record time.

Survey Results: ‘Are You Currently Hiring?’

The I-Connect007 research team invited readers to share their thoughts on what's happening with staffing and retention to help prepare for an upcoming issue on this important topic. Here, we delve into the first question, "Are you currently hiring?"

The Aerospace and Defense Chapter of the HIR

Nolan Johnson and Andy Shaughnessy recently spoke with Jeff Demmin of Keysight Technologies, who breaks down the work his team has done on the Aerospace and Defense Chapter of the Heterogeneous Integration Roadmap (HIR).


PCB Technologies Focuses on an All-in-One Solution

Recently, PCB Technologies reached out to us with news about their new All-In-One offering. Intrigued, we followed up and spoke with VP of Marketing and Business Development Arik Einhorn to get more details on the All-In-One services. We’ve included the short article and the interview here.

Real Time with… AltiumLive 2020: Vince Mazur Previews New Design Rule Features

Altium Technical Marketing Manager Vince Mazur discusses his presentation at the recent AltiumLive, which focused on updates to Altium Designer's approach to creating design rules and constraints. Vince explains that these features will be more intuitive for the user, and the update, which is currently in beta, will be released in the future. The company is shifting from “rule-centric” design rules features to capabilities that are more “design-centric,” with applicable rules for each object available at one click.

I-Connect007 Editor's Choice: Five Must-Reads for the Week

Welcome to the Halloween issue of the I-Connect007 Top Five Editor’s Picks! This year’s Halloween lands on a doozy of a day. Astronomers among us will, undoubtedly, already have noticed that not only does the spooky holiday fall on a Saturday night, but it also falls exactly on a full moon—and a Blue Moon, at that! The last time a Halloween Blue Moon occurred in all time zones was in 1941. As if there weren’t enough “ghoulishness” already, 2020 delivers yet another rare occurrence.

Real Time with… Altium Live Europe 2020: Rick Hartley’s Secrets of PCB Optimization

As Lawrence Romine said in his introduction, “There’s that moment when you sit in the crowd and hear Mr. Rick Hartley speak that you know you’ve arrived in PCB design.” With 50 years in the industry focused on circuit and PCB design—and as a specialist in EMI, noise, and signal integrity issues—Rick Hartley was invited to talk about PCB optimization. Pete Starkey provides an overview of the presentation.

Meet Dugan Karnazes, Design007 Columnist

Meet Dugan Karnazes, one of our newest Design007 columnists! Dugan’s columns will cover new ways to solve classic engineering problems for technical organizations.

How to Benefit From Robotic Soldering Processes

Webinars are in vogue! But in Pete Starkey's experience, the master of the technical webinar with many years’ experience of delivering first-rate events is Bob Willis—electronics assembly specialist, soldering expert, and provider of training and consultancy in electronics manufacture. Here, Pete recaps Bob’s presentation on the upcoming robotic soldering experience.

Real Time with… AltiumLive Europe 2020: Eric Bogatin’s ‘Unlearning’ Keynote

Pete Starkey admits to not being a Star Wars freak, but he was impressed by Yoda’s iconic wisdom and philosophy and intrigued by his advice that, “You must unlearn what you have learned.” Here, he describes how attending Dr. Eric Bogatin’s keynote at the AltiumLive Europe 2020 Virtual Summit was an enlightening experience.

Brad Griffin Discusses Cadence’s New Transient Solver Technology

Andy Shaughnessy speaks with Brad Griffin, product marketing director for Cadence Design Systems, about their new Clarity 3D Transient Solver, which is designed for system-level EMI simulation. Brad explains how the new solver, based on the company’s matrix technology, can yield results 10 times faster than existing solvers when simulating IC packages, PCBs, and SoIC designs.

Real Time with… AltiumLive Europe: If You Don’t Know How It’s Made, How Can You Possibly Design It?

Designers attending the AltiumLive Europe 2020 Virtual Summit had the opportunity to see at first-hand how circuit boards were made to help them make informed design-for-manufacturing decisions. Pete Starkey details how Würth Electronik welcomed AltiumLive to its Niedernhall factory to take a virtual tour.

Real Time with… AltiumLive 2020: Cross-Disciplinary Thinking With Eli Hughes

Eli Hughes, co-founder of TZero, discusses his AltiumLive presentation "Crossing the Chasm: The Road to Becoming a Full-Stack Hardware Engineer" with Andy Shaughnessy. Hughes explains the value of understanding multiple engineering disciplines, and he used his company's work with the beer fermentation process to highlight the need to avoid "staying in your lane" to succeed as an engineer.


I-Connect007 Editor’s Choice: Five Must-Reads for the Week

After a crazy year like this, we shouldn’t be surprised that this trade show season is unlike any other. Here’s one of the many “silver linings” of 2020: We actually dodged a bullet earlier this year when COVID-19 hit after most of our industry’s big events had taken place. In this week’s top five, we have an assortment of trade show and conference news items, plus a few examples of technological trends and innovation.

Real Time with… AltiumLive Europe: 21st-Century Tools Keynote

Good morning, Europe!” Altium VP of Marketing Lawrence Romine said as he introduced the European edition of Altium’s PCB design conference—established as an annual must-attend event, but for 2020 presented in a virtual format. Pete Starkey brings you the details from AltiumLive Europe's opening keynote on 21st-century tools and what's coming in 2021.

Real Time with… AltiumLive 2020: Early Communication Key to Success of OSV Project

Rob Cooke, director of engineering at Calumet Electronics, discusses his role in the Open Source Ventilator (OSV) project that yielded ventilator PCBs in record time. He and project partners, Dugan Karnazes of Velocity Research and Chris Denney of Worthington Assembly, recounted this story during a panel at the virtual AltiumLive.

EIPC Technical Snapshot: Automotive Technology

Although current circumstances have forced the postponement of its live conferences, seminars, and workshops, EIPC continues to provide a platform for the exchange and dissemination of the latest knowledge and technical information to the European interconnection and packaging industry. Pete Starkey details how its current series of technical snapshots, delivered in a webinar format, address technology challenges facing the automotive, telecom, and high-speed sectors of the industry.

Real Time with… AltiumLive: Eric Bogatin on Unlearning What You’ve Learned

The second day of the virtual AltiumLive 2020 event got off to a great start with a class by Dr. Eric Bogatin. It was officially titled “You Must Unlearn What You’ve Learned,” but it could have just as easily been called “Designing Interconnect That Sucks Less.”

I-Connect007 Editor's Choice: Five Must-Reads for the Week

Trade shows and technical conferences haven’t died; they’ve just moved online. The trade show season continues in virtual full force this week, and event coverage dominates the top five this week. Surprisingly, I don’t see events as this week’s theme. No, this week’s theme is “pundits.” We have Walt Custer’s industry outlook, seven experts on additive electronics, a designers conference keynote, and the IPC’s government relations expert. Don’t get me wrong: These folks are asked to speak to the industry for a good reason. They know their subject matter, and they present it skillfully. This week’s top five picks are worth reading.

Real Time with… AltiumLive 2020: Lawrence Romine on Successful U.S. Event

Andy Shaughnessy and Lawrence Romine, vice president of corporate marketing for Altium, discuss some of the lessons learned from last week's virtual U.S. AltiumLive, as well as what attendees can expect from the European show, which takes place October 20–22, 2020.

Real Time with… AltiumLive 2020: Happy Holden’s Panel Discussions Review

AltiumLive 2020 was a virtual event, and Happy Holden attended all the keynotes, as well as many other sessions. This article summarizes three panel discussions from Dugan Karnazes, Dr. Eric Bogatin, and Judy Warner, which were all worth the time investment.

Part 6 of Siemens’ Digital Twin Webinar Series: Single CAM Solutions

I-007e Micro Webinars recently released a free, on-demand series titled “Implementing Digital Twin Best Practices From Design Through Manufacturing” with Siemens' Jay Gorajia. In part 6, Gorajia discusses a “Single CAM Solution for All Process Engineering Tasks.”

Real Time with… AltiumLive 2020: Jeremy Blum on Engineering and the Supply Chain

During the last day of this year’s AltiumLive event, Dan Feinberg sat in on a very interesting talk by Jeremy Blum, who is the director of engineering for Sharper Tools Inc. Blum’s presentation was entitled “Leveraging Engineering Expertise for Supply Chain Success," and his goal was to convince the audience that taking a more proactive role in supply chain and manufacturing decisions can reduce your time to marker, workload, and product cost.


Real Time with… AltiumLive 2020: Eli Hughes’ Full-Stack Hardware Engineer Keynote

Nolan Johnson details TZero Co-founder Eli Hughes' keynote presentation titled “Crossing the Chasm: The Road to Becoming a Full-Stack Hardware Engineer,” demonstrating how it takes cross-disciplinary thinking to truly innovate.

Real Time with… AltiumLive 2020: Steven Sandler’s Simulation Keynote

Steven Sandler, managing director at Picotest, delivered a detailed and informative keynote at AltiumLive 2020 on worst-case fault simulation. Nolan Johnson details how Sandler's presentation detailed the fundamental tenets of worst-case simulation, illustrated with lots of technical examples and anecdotal stories.

Real Time with… AltiumLive 2020: Heidi Barnes Discusses Signal Integrity Panel

Andy Shaughnessy speaks with Heidi Barnes, a signal and power integrity applications engineer with Keysight Technologies, about the panel she participated in during the virtual AltiumLive. She also discusses the need for young engineers to absorb knowledge from their more seasoned co-workers, and why it's so important to follow this advice: "Read the manual!"

I-Connect007 Editor's Choice: Five Must-Reads for the Week

It’s showtime! This past week, we saw quite a bit of news about virtual trade shows. It’s great to see show managers pivot from live, in-person events to virtual shows with only a few months to make it all happen. How would you like to be a show manager today?

Real Time with… AltiumLive 2020: Greg Ziraldo on a New Approach to DFM

Andy Shaughnessy speaks with Greg Ziraldo, senior director of operations at Advanced Assembly, about his AltiumLive panel, "Design With Manufacturing." Greg discusses things that designers and electrical engineers should keep in mind regarding assembly during the design process, as well as a few ideas that he hopes attendees will take away.

Real Time with… AltiumLive 2020: A Novel Idea—Design With Manufacturing

Andy Shaughnessy speaks with Jeremie Waller, senior electrical engineer at Quantel USA, about the panel he’ll be participating in during AltiumLive 2020 on design with manufacturing. He and panelists Gerry Partida of Summit Interconnect and Greg Zhiraldo of Advanced Assembly will discuss why designers need to see their fabrication and assembly providers as true partners, not just customers, and why communication is such a vital part of the design process.

Real Time with… SMTAI 2020: Reflections on the Technical Conference

This year’s SMTA International Conference and Exposition went virtual! Pete Starkey explains how the SMTA team did a fine job in difficult circumstances to present an interactive show and technical conference. Here, he highlights four of the papers that particularly caught his interest.

Combatting Thermal Challenges With TRM Software

Johannes Adam is the creator of a simulation tool called Thermal Risk Management (TRM) used to help PCB designers and design engineers predict hot spots on the board before during layout. He and Douglas Brooks, founder of UltraCAD Design, have used the tool to produce several technical articles and a book on the subject. In this interview, they tackle the biggest misconceptions they see from designers and engineers who deal with thermal management issues.

Real Time with… AltiumLive 2020: The Need for Simulation in High-Speed PCB Design

Andy Shaughnessy and Picotest Managing Director Steven Sandler discuss the panel that Steven will be participating in at AltiumLive 2020. The panel, led by Dr. Eric Bogatin, will feature co-panelists Heidi Barnes of Keysight Technologies, Rula Bakleh of Graphcore, and Istvan Novak of Samtec, who will discuss various ways to reduce signal and power integrity issues by using simulation, measurement, and other tricks of the trade. Steven also discusses his presentation on simulation, which focuses on SPICE simulation methods.

My Experience at SMTAI 2020 Virtual

Denny Fritz shares his experience while attending SMTAI, concentrating on the exhibition portion of the virtual show. He also compliments SMTA on organizing and operating the virtual event.


Real Time with… SMTAI 2020: Technical Conference Review

SMTAI 2020, which was converted to a virtual event, took place from September 28–30. I attend every year, but since there was no keynote in the virtual format, I went straight to the technical conference. This event covered a broad range of topics related to everything in assembly. Over 90 technical presentations are available, but this report covers just some of the sessions I attended.

Just Ask John Mitchell: The Exclusive Compilation

We asked for you to send in your questions for IPC President and CEO John Mitchell, and you took us up on it! We know you all enjoyed reading these questions and answers, so we’ve compiled all of them into one article for easy reference. We hope you enjoy having another bite at the apple. And if you’d like to hear more from John Mitchell, view his column series “One World, One Industry.”

I-Connect007 Editor's Choice: Five Must-Reads for the Week

Most all the action this week involved the STMA International Conference and Exposition. I-Connect007’s Real Time with… video interviews generally led the way for views and clicks. In each item, the intent was to make things better in some fashion. Whether it was pivoting on trade show delivery, optimizing the metalization process in the fab, adding more AI to manufacturing capital equipment, unifying and furthering the concept of the digital twin concept, or responding to company growth by upgrading systems with the help the equipment manufacturers, all these news items speak to being adaptable and forward-thinking.

Flexible Circuit Technology Workshop #5 Tackles Structures, Applications, Materials, and Manufacturing Processes: Think and Plan in Three Dimensions!

In just 15 minutes, flex expert Joe Fjelstad will teach you about implementing this useful technology into your manufacturing operation. Joe suggests you start with defining your end-product requirements and understanding cost and product life cycle expectations, as well as end-user needs. He further addresses the many considerations with adopting this useful technology.

Stop Relating Trace Temperature to Current Density

Many design engineers and even many software suppliers make the significant mistake of equating changes in trace or via temperature with current density. This is incorrect at best and dangerous at worst. There is little if any correlation between temperature and current density. Current and trace dimensions (among other things) are the relevant variables, but current density is not. I hope by the end of this article you will see why. Here are four illustrations that will help you understand this.

Manufacturing Test Strategy Tools: Part 4 of Siemens’ Digital Twin Webinar Series

I-007e Micro Webinars recently released a free, on-demand series titled “Implementing Digital Twin Best Practices From Design Through Manufacturing” with Siemens' Jay Gorajia. In Part 4, Gorajia discusses “Manufacturing Test Strategy Tools in the Hands of Designers.”

Just Ask John Mitchell: Blurring the Lines of Technology

First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, and Eric Camden in our “Just Ask” series. Now, it’s IPC President and CEO John Mitchell’s turn! A regular PCB007 columnist, John focuses on many of the challenges affecting the global electronics industry supply chain. Over the years, he has served as an engineer, manager, and executive at a variety of companies and organizations. We hope you enjoy “Just Ask John.”

Just Ask John Mitchell: Plans For Knowledge Transfer?

First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, and Eric Camden in our “Just Ask” series. Now, it’s IPC President and CEO John Mitchell’s turn! A regular PCB007 columnist, John focuses on many of the challenges affecting the global electronics industry supply chain. Over the years, he has served as an engineer, manager, and executive at a variety of companies and organizations. We hope you enjoy “Just Ask John.”

Just Ask John Mitchell: Global Book-to-Bill Number

First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, and Eric Camden in our “Just Ask” series. Now, it’s IPC President and CEO John Mitchell’s turn! A regular PCB007 columnist, John focuses on many of the challenges affecting the global electronics industry supply chain. Over the years, he has served as an engineer, manager, and executive at a variety of companies and organizations. We hope you enjoy “Just Ask John.”

Real Time with…SMTAI 2020: ASC Makes Lemonade Out of Lemons

Steve Williams and Anaya Vardya, president and CEO of American Standard Circuits (ASC), discuss the upcoming virtual SMTAI show and how the company is “making lemonade out of lemons.” As they point out, there may be no face-to-face interaction, but virtual shows are open to attendees from around the world with no travel or hotel costs. Anaya explains how the COVID-19 lockdown has caused ASC to become more creative in its marketing efforts, including holding webinars and publishing two eBooks with I-Connect007. They also discuss ASC’s holistic approach to the marketplace, with a diversified product mix across various segments.


I-Connect007 Editor’s Choice: Five Must-Reads for the Week

In this week’s picks, we bring you news about the upcoming SMTA International 2020, IPC’s plans for the fall, a move for Burkle North America’s headquarters, and advice on how to select the correct CAD tool. And we have the first installment of our newest series: “Just Ask John Mitchell.”

Just Ask John Mitchell: Greenfield Capacity in North America?

First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, and Eric Camden in our “Just Ask” series. Now, it’s IPC President and CEO John Mitchell’s turn! A regular PCB007 columnist, John focuses on many of the challenges affecting the global electronics industry supply chain. Over the years, he has served as an engineer, manager, and executive at a variety of companies and organizations. We hope you enjoy “Just Ask John.”

Just Ask John Mitchell: Emerging Engineers and Managers

First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, and Eric Camden in our “Just Ask” series. Now, it’s IPC President and CEO John Mitchell’s turn! Today, John answers this question: Does IPC have an interest in emerging managers, as well as emerging engineers?

Just Ask John Mitchell: Are IPC’s Positions Dictated by Politics?

First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, and Eric Camden in our “Just Ask” series. Now, it’s IPC President and CEO John Mitchell’s turn! A regular PCB007 columnist, John focuses on many of the challenges affecting the global electronics industry supply chain. Over the years, he has served as an engineer, manager, and executive at a variety of companies and organizations. We hope you enjoy “Just Ask John.”

I-Connect007 Editor's Choice: Five Must-Reads for the Week

Two weeks ago, when it was my turn to pick the top 5, I made a comment about themes. I’m making a stretch here, but this week’s theme is technical education. Three out of the five most popular news items this last week reported on upcoming technical events or publications.

Mentor and Z-zero Collaborate on New Stackup Tool

I recently spoke with Max Clark, business unit manager with Mentor, a Siemens Business, and Z-zero founder Bill Hargin about the newly formed partnership that resulted in a new stackup tool that Mentor is now selling worldwide. Fun fact: Hargin used to work for Mentor as part of the HyperLynx team, which now has an interface with Z-planner Enterprise. Talk about coming full circle.

Documenting Your Flex Circuit Design

As a flex circuit applications engineer, when I receive an RFQ, the first thing I do is look at the customer’s data and review their manufacturing notes. Quite often, I find notes that supersede IPC specifications in manufacturing documents, as customers often believe these added notes and associated specifications will make the circuit more robust. However, these non-standard IPC manufacturing specifications/notes can wreak havoc on the manufacturing process and can actually lead to a less robust circuit.

Just Ask Eric: Selecting the Right Lead-Free Solder for Your Application

First, we asked you to send in your questions for Happy Holden and Joe Fjelstad in our “Just Ask” series. Now, it’s Eric Camden’s turn! A regular SMT007 columnist, Eric is a lead investigator at Foresite Inc., an analytical testing and consulting laboratory. As a reliability expert, Eric has worked with many large OEMs and contract manufacturing companies to optimize their manufacturing processes and assist with the identification of electronic hardware failures utilizing various analytical techniques. He also specializes in optimizing PCBA processes and identifying hardware failures through analysis. We hope you enjoy “Just Ask Eric.”

I-007eBook Review: Thermal Management From a Fabricator’s Perspective

The Printed Circuit Designer’s Guide to… Thermal Management: A Fabricator’s Perspective, written by Anaya Vardya, founder and CEO of American Standard Circuits, is an important book for a number of reasons. The most important reason is right there in the title; it is from the fabricator’s perspective. Besides explaining all aspects of thermal management—from thermal vias and metal-core boards to mixed technology—this book also describes the various applications of thermal dielectrics, their properties, and their incorporation into the actual fabrication of PCBs.

I-Connect007 Editor's Choice: Five Must-Reads for the Week

This week, we have a little bit of everything. There’s quite a bit of new technology news, along with an I-Connect007 eBook on thermal design techniques, trade show talk, and an interesting take on trading in capital equipment. We’ve been following the “digital twin” for the past few years, and when Siemens released a webinar on the topic this week, Happy Holden got a sneak peek and wrote a review that turned out to be one of our most popular recent articles.


American Standard Circuits’ New Book Covers Thermal Management From a Fabricator’s Perspective

I had the opportunity to speak with Anaya Vardya, president and CEO of American Standard Circuits, about "The Printed Circuit Designer’s Guide to…Thermal Management: A Fabricator’s Perspective," which serves as a desk reference for designers on the most current thermal management techniques and methods.

Just Ask Happy: Resin-Filled Vias, Without Voids

We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.

I-Connect007’s Latest Innovation: Joe Fjelstad’s E-Workshop on Flexible Circuits

Denied the prospect of physically attending conferences, symposia, or live workshops by travel and social-distancing restrictions, Pete Starkey welcomed the opportunity to enjoy a privileged preview of I-Connect007’s latest innovation in technical webinars: a series of e-workshops on flexible circuit technology with the industry’s leading authority—Joe Fjelstad.

This Month in Design007 Magazine: Thermal Fundamentals With Mike Jouppi

The I-Connect007 team recently interviewed Mike Jouppi, one of the champions of thermal management in PCBs. Mike spent decades working on updating the old IPC current-carrying data, which dated back to the 1950s, and he is the primary architect behind IPC-2152— the standard for determining current-carrying capacity in printed board design. As Mike explained in this wide-ranging interview, even if you’re using the latest thermal design software, you still need to have a firm understanding of the fundamentals.

NVIDIA’s Three Next-Generation GPUs Excite Consumers

Finally, the product release that many had been waiting for. NVIDIA recently announced its next-generation RTX 3000 Series GPUs, and the stated capabilities are amazing. Dan Feinberg has all of the details.

The Role of EDA Tools in Creating Fab Notes

When discussing fab notes, there’s a lot of focus on what designers should and should not include in the package. But what is the role of EDA tools in this process, and can intelligent data formats streamline the tasks and help eliminate fab notes that are less than fantastic? In this interview, Pat McGoff, market development manager for Mentor, a Siemens Business, speaks frankly about fab notes and what EDA tool companies like Mentor can do to automate this process.

Catching up With Nate Doemling, New CEO of IMS

Dan Beaulieu recently interviewed Nate Doemling with Intelligent Manufacturing Solutions (IMS) in New England about his new role at the company. After serving on the IMS board of directors for several months, Doemling joined the company as CEO in January 2020.

An Excerpt From the Book ‘Thermal Management: A Fabricator’s Perspective’

Thermal management in the printed circuit board (PCB) world is big business! A recent Markets and Markets report projects the thermal management market to reach $16 billion by the year 2024 with an average CAGR of 8% over that period. We have chosen to focus this book on providing designers a thermal management desk reference on the most current thermal management techniques and methods from a PCB fabrication perspective, including a case study on an extreme mixed-technology design that we recently produced. We hope you find value in our efforts.

I-Connect007 Editor's Choice: Five Must-Reads for the Week

When compiling my Top Five, I tend to let the reader views guide my choices. Oh, sure, sometimes a news item is significant well beyond the reads it receives; that’s why this is an editor’s picks, not a strict Top Five. Still, readership habits inform my choices. That makes it even more interesting when a week demonstrates a theme so convenient as to seem contrived. Take this week, for example. In this week’s top five, four of the top five are news reports on mil-aero topics. You, dear readers, gobbled up the military and aerospace news this week. The outlier is, as we all would expect, a conference report from our very own Pete Starkey.

Real Time With…I-Connect007: The App Notes and Fab Notes Roundtable

Most of our readers are familiar with our Real Time With... video program. For over a decade, we’ve been a staple at trade shows and conferences around the world, doing on-camera interviews with the industry’s top technologists, managers, and executives. Now, Real Time With…I-Connect007 is turning the cameras around to focus on recent issues of our magazines. In this first installment, four of our recent contributors—Dana Korf, Jen Kolar, Mark Thompson, and Kelly Dack—review the June and August issues of Design007 Magazine, which covered app notes and fab notes, respectively.


Promoting a Circular Economy in Electronics Manufacturing

The sixth international Electronics Goes Green Conference was held as an online virtual. Pete Starkey provides a recap of the event, which provided insight into innovative eco-design and extended reliability from the perspective of iNEMI’s roadmap.

This Month in SMT007 Magazine: Robustness Is Not the Same as Reliability

Bob Neves discusses a disconnect he sees in reliability testing between what’s being tested and what happens out in the field, as well as why most reliability tests these days should instead be considered robustness tests.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week, we have quite a potpourri for you. There's good news about the PCB market. And as this year continues to surprise us at every turn, companies are discovering the true nature of their leaders. Todd Kolmodin has a great column about bosses and leaders and why the two words are not synonymous. Not to be outdone, columnist Barry Olney found a way to explain the wavelength of electromagnetic energy by using a chocolate bar and a microwave oven. We also have great articles by Sagi Reuven and Pete Starkey.

Just Ask Joe: Standardized Grid Designs

First, we asked you to send in your questions for Happy Holden. Now, it’s Joe Fjelstad’s turn! Inventor, columnist, instructor, and founder of Verdant Electronics, Joe has been involved with rigid PCBs and flexible circuits for decades, and he’s ready to share some of his knowledge with our readers. We hope you enjoy “Just Ask Joe.”

Catching up With VirBELA’s Glenn Sanford

Have you been disappointed by trade shows and conferences being canceled or postponed? Have you wondered how some of these events are going virtual? Dan Beaulieu speaks with Glenn Sanford, chief strategy officer of VirBELA, about the company’s platform and its impact on events.

I-Connect007 Survey on Leadership: More Important Now Than Ever

The I-Connect007 research team recently conducted a survey on leadership, covering everything from leadership qualities to stories and lessons learned from inspirational leaders. Read what respondents from the industry had to share on the topic of leadership.

Just Ask Joe: The Land Warrior Project

First, we asked you to send in your questions for Happy Holden. Now, it’s Joe Fjelstad’s turn! Inventor, columnist, instructor, and founder of Verdant Electronics, Joe has been involved with rigid PCBs and flexible circuits for decades, and he’s ready to share some of his knowledge with our readers. We hope you enjoy “Just Ask Joe.”

Just Ask Joe: Automotive Conformal Coatings

First, we asked you to send in your questions for Happy Holden. Now, it’s Joe Fjelstad’s turn! Inventor, columnist, instructor, and founder of Verdant Electronics, Joe has been involved with rigid PCBs and flexible circuits for decades, and he’s ready to share some of his knowledge with our readers. We hope you enjoy “Just Ask Joe.”

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week, the top five is full of progress in technology and financial performance. It’s more evidence that the electronics industry, at its core, continues to thrive.

Got a Question? Just Ask Joe!

A few months ago, we launched our “Just Ask” series with Happy Holden. Many readers took us up on it, sending all manner of questions for happy to answer. Now, Joe Fjelstad—inventor, technologist, author, and Flex007 columnist—is getting in on the action. Here’s your chance to pick Joe’s brain. What’s the one question about this industry that you’ve always wanted to ask Joe?


Just Ask Joe: Optimum Copper Plating for Thermal Via Farms

First, we asked you to send in your questions for Happy Holden. Now, it’s Joe Fjelstad’s turn! Inventor, columnist, instructor, and founder of Verdant Electronics, Joe has been involved with rigid PCBs and flexible circuits for decades, and he’s ready to share some of his knowledge with our readers. We hope you enjoy “Just Ask Joe.”

Understanding MIL-PRF-31032, Part 2

In Part 2 of this series on understanding the military PCB performance standard MIL-PRF-31032, Anaya Vardya explains how the first step in the process is to develop a quality management plan (QMP).

New Solder Joint Technology From Schmartboard

Schmartboard has a surprisingly simple patented process to improve solder joint reliability; in this interview, they discuss the process in detail, along with their search for a go-to-market partner.

The Pros and Cons of Working Remotely

For this issue of Design007 Magazine, Managing Editor Andy Shaughnessy asked Patrick Crawford if IPC had any insight into how the “new normal” of working from home has impacted their members. Here is what the IPC technical staff had to say about the advantages and disadvantages of working remotely, as well as working with IPC volunteers who are new to working from the dining room table.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week’s picks include a little of everything. We have an interview with the founder of Avishtech, a new EDA software company that has a spin on field solvers and stackup tools. We also have an interview with Mike Carano, who discusses the need for mentors. Then, there’s news about partnership between Koh Young and Mentor, and an iNEMI "best practices" guide for disinfecting your facility. Finally, we've compiled all of the "Just Ask Happy" entries into a single document for your viewing pleasure. Happy Friday!

Joe Fjelstad Updates His Online Flex Workshop

Joe Fjelstad has been an innovator in flexible and rigid-flex technology for four decades. About 10 years ago, I-Connect007 helped Joe produce an online workshop on flex technology based largely on his book Flexible Circuit Technology, which was first published in 1994 and is now heading into its fifth edition. In this online video course, Joe offers a primer on flexible circuits, covering everything from the history of this technology through the most cutting-edge technologies.

Avishtech: A New Player in the Field Solver and PCB Simulation Tools Market

It has been a crazy year with lots of ups and downs. But within the clouds, we’ve seen plenty of silver linings, too. Case in point: Avishtech, a brand-new company lead by founder and CEO Keshav Amla. (You may be familiar with his father, Tarun Amla, a veteran PCB materials technologist who is now with ITEQ.) We recently caught up with Keshav and asked him to discuss his company’s simulation tools, his plans for the company, and what it’s like launching a company in this “new normal.”

Just Ask Happy: The Exclusive Compilation

We asked for you to send in your questions for Happy Holden, and you took us up on it! We loved them so much, and we know that you did too, so we’ve compiled all 21 questions and answers into one document for easy reference.

This Month in Design007 Magazine: Dear Designers—Please Include a Sanity Check

We recently asked Rick Almeida, DownStream co-founder, and Technical Sales Manager Ray Fugitt to discuss why so many fabricators are still receiving (and correcting) inaccurate and incomplete data from their customers. And if fabricators and designers are content with this current process, is it really a problem after all?

I-Connect007 Editor's Choice: 5 Must-Reads for the Week

Nolan Johnson's top 5 picks this week include the SpaceX Dragon splashdown, the Mars 2020 mission’s Ingenuity helicopter—featuring an interview with the carbon fiber company that built the helicopter’s landing gear—and the U.S. Air Force’s efforts to secure space systems with the help of volunteer hackers. Readers also responded to news from IPC and iNEMI, and blockchain turned out to be hugely popular.


Flex Workshop Update With Joe Fjelstad and Anaya Vardya

When Anaya Vardya, president and CEO of American Standard Circuits, heard that Joe Fjelstad, founder and CEO of Verdant Electronics, was releasing an updated version of his flexible circuit technology workshop, he knew ASC had to be a sponsor. We recently asked Joe and Anaya to discuss the flexible circuit technology workshop, as well as the ongoing need for flex and rigid-flex training—even in the time of COVID-19—as the demand for flex continues to rise.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Say what you will about 2020, but it certainly isn’t boring. There’s a lot going on in the PCB world, and there’s something for everyone in this week’s top five picks. And it’s all positive, despite the lingering presence of COVID-19 and its aftereffects.

Just Ask Happy: Monitoring Via Reliability on a Lot-by-Lot Basis

We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut by covering technology, the worldwide fab market, and everything in between. How would you monitor microvia reliability on a lot-by-lot basis?

Just Ask Happy: What Would You Change About the Industry?

We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut by covering technology, the worldwide fab market, and everything in between. What would you change about the industry?

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week’s top five is a smattering across the industry. There’s an update on an established vendor and a press release from a startup. Then, we have two columns: one on M&A, and the other on supply chain disruptions. Finally, I highlight an interview from a U.S. food distributor sales manager, shedding light on the similarities of supply chain interruption in all industries. It's quite an assortment, but what they all have in common is that readers found these items compelling.

Just Ask Happy: Manufacturing Issues From a Designer’s Viewpoint

We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.

Find the Perfect Employee With D.B. Management Group

If you’re searching for the right person for an open job in the PCB industry, look no further than D.B. Management Group’s recruiting page in each of the I-Connect007 magazines.

Selling in a Post-COVID Environment, Part 2

Nolan Johnson continues his conversation with Penny Cole about how COVID-19 has affected her industry’s distribution channels and supply chain, as well as how she has adapted to the shifting dynamic as a salesperson.

Selling in a Post-COVID Environment, Part 1

Nolan Johnson spoke with Penny Cole of Lotus Foods about how COVID-19 has affected her industry’s distribution channels and supply chain, as well as how she’s adapted to the shifting dynamic as a salesperson.

With App Notes, Trust But Verify

For this month’s issue on app notes, I checked in with Clive “Max” Maxfield. The author of Bebop to the Boolean Boogie and countless technical articles and blog posts, he has been involved with all manner of app notes and datasheets during his long career. Max shares his thoughts on data. As he points out, “Remember that these documents are not written by an ‘infallible creator.’”


A New Job Is One Click Away at I-Connect007 Career Opportunities

In the pages of I-Connect007’s monthly magazines and newsletters, you’ll find job openings for positions that span the entire circuit board supply chain. Here’s a quick sample of available positions: chief technology officer, director of business development, senior process engineer, image department operator, development chemist, SMT field technician, and sales reps for territories that span the U.S.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Like a bad penny, COVID-19 just keeps coming back and affecting the PCB industry. This week, we saw more industry events going fully virtual—a trend that’s likely to continue. But as Chris Mitchell explains, the COVID-19 outbreak is also forcing lawmakers and organizations to work together for the good of the U.S. electronics supply chain. Sometimes, it takes a crisis to make everyone cooperate, so let’s celebrate these little victories.

Book Excerpt: Power Integrity By Example, Chapter 5

The following is an excerpt from The Printed Circuit Designer's Guide to... Power Integrity by Example, written by Fadi Deek of Mentor, a Siemens Business. In this free eBook, Deek addresses problematic issues within electronic transmissions, and presents a variety of simulations and analyses in every chapter.

What Is the Proper Role of App Notes?

There’s a disconnect in the design segment. Some designers say they follow app notes every time, but a growing number of designers approach app notes with a wary eye. Many of the leading voices in the design community have been advising designers not to rely on app notes without running the numbers first. We decided to ask PCB design instructors Rick Hartley and Dan Beeker to help us shine a light on this issue.

Cyberattack! Think It Couldn’t Happen To You? Think Again!

Eric Cormier and Dave Ryder of Prototron address the ransomware attack that locked them out of their system last December, bringing business to a screeching halt and forcing them into the arduous process of a full rebuild. With things finally starting to normalize, Eric and Dave now offer precautionary advice they’ve accumulated over the past six months.

But Wait, There’s More Happy-ness: Happy Holden Wants Your Questions

The “Just Ask Happy” series has been so popular that we’re giving readers another bite at the apple. Here’s your chance to send Happy Holden more of your questions. What’s the one question about this industry that no one has ever been able to answer to your satisfaction?

I-Connect007 Leadership Survey: Valuable Lessons From Grandma

The I-Connect007 research team has been surveying readers on the topic of leadership as part of our ongoing planning for upcoming issues. As this response illustrates, great examples of leadership can be found everywhere—provided we're paying attention.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

The common theme in this week’s Top 5 editor’s picks is “change.” We’re talking change in the form of forwarding process, achieving milestones, evolving, and improving metrics. This week’s picks are not only newsworthy but also captured reader attention based on metrics. If you haven’t read any other news items from the industry this week, I propose these five must-reads.

This Month in Design007 Magazine: When Working Remotely, Cybersecurity Is a Necessity

When we started planning this issue on working remotely, we knew we’d have to speak with Stephen V. Chavez, chairman of the Printed Circuit Engineering Association (PCEA). We recently asked Steph to discuss some of the security measures that his company employs and what his experience has been like since he began working out of his Arizona home office full-time several months ago.

Just Ask Happy: Integrating Design Processes With IEEE HIR

We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.


Understanding MIL-PRF-31032, Part 1

Over the course of this series, Anaya Vardya will discuss topics such as MIL-PRF-31032 requirements, the quality plan, responsibilities of the Technical Review Board (TRB), and the testing and reporting requirements for the certified shop into the DLA.

Chris Hanson: New Ventec IMS Dielectrics Rated for Higher Temps

Andy Shaughnessy recently spoke with Chris Hanson, global head of IMS Technology for Ventec International Group. During their conversation, Chris discusses his group’s recent efforts to create new IMS materials, with a focus on dielectrics. As Chris explains, Ventec has developed several new dielectrics that can withstand much higher operating temperatures, one of which is UL-rated for a maximum operating temp of 155°C, which may be the highest for an IMS dielectric.

Just Ask Happy: Calculating Trace Temps in a Vacuum

We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.

Just Ask Happy: Mechanically Drilled Blind and Buried Vias

We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

The USMCA trade agreement was just the tip of the iceberg in news affecting our industry this week. We also saw more young people getting involved in the industry, an HDP User Group webinar on automotive thermal issues, and more questions for our own Happy Holden—this time, on stacked microvia reliability, or the lack thereof.

Just Ask Happy: Two-Layer Low-Speed PCBs

We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.

Catching up With Fane Friberg: Supply Chain Management Expert

Dan Beaulieu recently spoke with Fane Friberg, principal at CEPHAS and a supply chain management expert, about how he started his company, as well as current market challenges he sees and what he thinks the future holds for companies—especially post-pandemic.

Materials for Automotive Applications: Thermal Management Issues

For Pete Starkey, the highlight of the recent HDP User Group Automotive Technology Webinar was Alun Morgan’s presentation on materials for automotive applications. This forward-looking informational session covered the latest developments in automotive standards and automotive electronic packaging.

IPC: Shawn DuBravac and Chris Mitchell on USMCA

On July 1, 2020, the USMCA trade act (United States-Mexico-Canada Act) phased in as a trade agreement guiding economic trade and growth in North America. Nolan Johnson spoke with both Shawn DuBravac, IPC’s chief economist, and Chris Mitchell, IPC’s vice president of global government affairs and an I-Connect007 columnist, about the impact of USMCA on North American electronics manufacturing.

Just Ask Happy: PCB Design For EE Undergrads?

We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.


Book Excerpt: Thermal Management With Insulated Metal Substrates, Part 3

The following is an excerpt from Chapter 3 of "The Printed Circuit Designer's Guide to... Thermal Management With Insulated Metal Substrates," written by Ventec International Group’s Didier Mauve and Ian Mayoh. In this free eBook, the authors provide PCB designers with the essential information required to understand the thermal, electrical, and mechanical characteristics of insulated metal substrate laminates.

Just Ask Happy: Stacked Microvia Reliability Issues

We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.

Just Ask Happy: The Future of 3D Printing

We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.

App Notes: What Are They Good For?

There are several schools of thought regarding IC manufacturers’ app notes. We wanted to find out more about this, so we spoke with Geof Lipman, director of operations for part data at Octopart.com, a component data platform acquired by Altium in 2015. Geof shared his thoughts on app notes, datasheets, and the need for due diligence when utilizing any unfamiliar data.

Just Ask Happy: Ground Reference Planes

We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Updates on trade shows, conferences, and associations dominated industry news this past week. Some events are returning to a physical venue; others are opting for a virtual version in 2020. Add to that a spate of cross-association cooperative agreements and new programs for career development coming from multiple associations, and you’ve delivered four of my top five picks.

Just Ask Happy: The Future of Mechanical Blind, Buried Vias

We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.

Just Ask Happy: Routing BGAs With High-Speed Diff Pairs

We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.

Book Excerpt: Signal Integrity by Example, Chapter 3

The following is an excerpt from The Printed Circuit Designer's Guide to... Signal Integrity by Example, written by Fadi Deek of Mentor, a Siemens Business. Deek explores how to reach effective design solutions and make strong engineering tradeoffs through analysis techniques, best design principles, and software tools to achieve accurate simulations and measurements.

Just Ask Happy: The Proper Order of Design Techniques to Improve Connectivity

We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between.


Ex Officio: Advice From Designers Who Recently Began Telecommuting

Most PCB designers are now working from home as a result of the COVID-19 lockdown. In a recent Design007 Magazine survey, we asked the following question: What lessons have you learned since you began designing PCBs from home? Here are just a few of the comments, edited slightly for clarity.

Happy Holden Is Taking Your Questions Now

Happy Holden, the industry icon and “Father of HDI,” is ready to answer your questions! What have you always wanted to ask Happy, but never thought you'd have the chance? Now is your chance! Please take a few minutes to jot down your questions for Happy. A select group of answers will be published in upcoming editions of I-Connect007 magazines and newsletters.

Elmatica’s Didrik Bech Accepts Role as IPC Cybersecurity Task Group Vice-Chair

On June 18, Nolan Johnson spoke with Didrik Bech, Elmatica CEO and I-Connect007 columnist, who was recently selected as vice-chair for IPC’s Cybersecurity Task Group. During their conversation, Didrik outlined the task group’s mission statement and the target audience for its work. He also shared specific examples where cybersecurity is increasingly important to the electronics manufacturing industry globally.

Book Excerpt: Producing the Perfect Data Package, Part 2

The following is an excerpt from Chapter 2 of Mark Thompson's I-Connect007 eBook The Printed Circuit Designer’s Guide to... Producing the Perfect Data Package. Mark is in engineering support at Prototron Circuits and a Design007 Magazine columnist.

Dana Korf: What Fabricators Expect From Designers

Andy Shaughnessy and Barry Matties spoke with Dana Korf, former chief PCB technologist for Huawei and currently principal consultant of Korf Consultancy, about the breakdown in communication between manufacturers and designers. Dana discusses exactly what a fabricator expects from a PCB designer, why these expectations are often not met, and the need for designers to make mistakes so that they can learn from them.

DownStream Technologies Update With Joe Clark

On June 15, Andy Shaughnessy spoke with Joe Clark, co-founder of DownStream Technologies, about the company’s drive to take care of its customers and employees throughout the pandemic and beyond. As the U.S. slowly starts reopening, Joe discusses some of his customers’ current challenges, especially those working from home for the first time, and how DownStream’s forecast has helped the company prepare for the uncertainties in the industry right now.

Book Excerpt: Thermal Management With Insulated Metal Substrates, Part 2

The following is an excerpt from the second half of Chapter 1 of "The Printed Circuit Designer's Guide to... Thermal Management With Insulated Metal Substrates," written by Ventec International Group’s Didier Mauve and Ian Mayoh. In this free eBook, the authors provide PCB designers with the essential information required to understand the thermal, electrical, and mechanical characteristics of insulated metal substrate laminates.

Letter to the Editor: Rick Hartley Offers Addendum on App Notes

In the June 2020 issue of Design007 Magazine, the I-Connect007 editorial team interviewed design instructors Rick Hartley and Dan Beeker regarding their belief that designers should not trust app notes until they've been proven to be accurate. After the issue was published this week, Rick emailed us with a few more points that he wished to contribute to the ongoing app note conversation.

Walt Custer’s EIPC Business Outlook Webinar: ‘You Can’t Sugarcoat This Stuff!’

In normal circumstances, it would have been the time of year for the EIPC Summer Conference, and Walt Custer would have opened the proceedings with his business outlook for the global electronics industry. However, circumstances were far from normal. Pete Starkey discusses some of the takeaways from Custer's global business outlook webinar, organized by EIPC.

Book Excerpt: Signal Integrity by Example

Editor's note: The following is an excerpt from "The Printed Circuit Designer's Guide to... Signal Integrity by Example," written by Fadi Deek of Mentor, a Siemens Business. Deek explores how to reach effective design solutions and make strong engineering tradeoffs through analysis techniques, best design principles, and software tools to achieve accurate simulations and measurements.


Dan Beaulieu, Part 2: Marketing in Uncertain Times

Dan Beaulieu, president of D.B. Management and an I-Connect007 columnist, and Nolan Johnson return for a second conversation on sales and marketing in the current business environment. In this conversation, Nolan asked Dan about the “wait and see” attitude some industry professionals have been leaning on during the second quarter of 2020.

Book Excerpt: Cornerstone of Smart Manufacturing—The Convergence of IT and OT

The following is an excerpt from Chapter 2 of the I-Connect007 eBook The Printed Circuit Assembler’s Guide to… Advanced Manufacturing in the Digital Age, written by Oren Manor of Siemens, a Siemens Business.

Book Excerpt: Power Integrity by Example

The following is an excerpt from "The Printed Circuit Designer's Guide to... Power Integrity by Example," written by Fadi Deek of Mentor, a Siemens Business. In this free eBook, Deek addresses problematic issues within electronic transmissions, and presents a variety of simulations and analyses in every chapter.

The iNEMI 2019 Roadmap: Optoelectronics

Continuing the series of webinars highlighting recently-published chapters of iNEMI’s 2019 Roadmap—the comprehensive guidebook to the future goals and needs of the electronics manufacturing industry—the installment on optoelectronics examined and discussed data transmission by optical technology. Pete Starkey provides an overview.

The Survey Said: Designers' Tips for Working Remotely

Most PCB designers are now working from home as a result of the COVID-19 lockdown. In a recent Design007 Magazine survey, we asked the following question: What tips do you have for working remotely more successfully?

Where The Jobs Are: The I-Connect007 Help Wanted Pages

If you’re looking for a career in the PCB industry—design, fabrication, or assembly—the I-Connect007 Career Opportunities section, jobconnect007.com, is the first place you should look. Right now, there are job openings for positions that span the entire circuit board supply chain, and you can submit your resume directly to the hiring managers by clicking on the ad.

PCB Builder from Digi-Key Lets Customers Order Directly From Board Shops

On June 2, components distributor Digi-Key Electronics announced the release of PCB Builder, a tool that lets customers have PCBs shipped directly from the fabricator. PCB Builder also allows customers to perform file layer checks and receive instant quotes from multiple fabricators. Andy Shaughnessy spoke with Josh Mickolio, supplier business development manager for Digi-Key, about the development of PCB Builder and what this tool means to PCB designers and design engineers.

Design007 Survey: Show Us Your Workspaces!

Since the COVID-19 lockdown began, more and more PCB designers and design engineers have moved into home offices. In this survey, we ask our designer and design engineer readers to share their thoughts on working from a home office: the dogs, the crying kids, everything. Best of all, we want to see photos of your workspaces!

Book Excerpt: Producing the Perfect Data Package

The following is an excerpt from Chapter 1 of Mark Thompson's I-Connect007 eBook "The Printed Circuit Designer’s Guide to... Producing the Perfect Data Package." Mark is in engineering support at Prototron Circuits and a Design007 columnist.

SpaceX Manned Mission Promises More Success for Milaero and Electronics Manufacturing

On May 30, 2020, SpaceX became the first non-governmental organization to send human cargo into orbit and to a successful docking rendezvous with the International Space Station (ISS). On June 1, Nolan Johnson spoke with military/aerospace consultant and I-Connect007 columnist Mike Hill about the significance of this mission.


This Month in SMT007 Magazine: Leaning on Leadership

It goes without saying that in times of crisis or great uncertainty, we often look to those in leadership positions to guide us and give us direction. In this interview with Barry Matties and Nolan Johnson, Tom Forsythe, executive VP of KYZEN, shares his insight on leadership and what he believes makes a good leader.

Joe O’Neil: Green Circuits Running Strong Under Current Social Restrictions

On May 28, Joe O’Neil, CEO of Green Circuits, updated Nolan Johnson on how the company continues to operate during the COVID-19 restrictions. O’Neil reflects on the rapid chain of events this past March when lockdowns were instituted in the San Francisco Bay area. After a brief but rapid shutdown, Green Circuits was back up and in production.

The iNEMI 2019 Board Assembly Roadmap

iNEMI continues to publish chapters of its 2019 Roadmap and recently presented an overview of its Board Assembly Roadmap Chapter in a webinar prefaced by Grace O’Malley, vice president of global operations. The new chapter is just the latest addition to this global effort from 23 working groups contributing expert input from all aspects of the electronics industry.

Autodesk’s Fusion 360 Merges ECAD, MCAD

Andy Shaughnessy spoke with Autodesk’s Matt Berggren about the company’s Fusion 360 EDA tool and the new capabilities added to the software. Matt explains how Fusion 360 blends ECAD and MCAD functionality in one environment and at an affordable price, and why he believes it will help round out Autodesk's electronic portfolio with end-to-end capabilities.

Ventec Book Excerpt: Thermal Management with Insulated Metal Substrates

The following is an excerpt from Chapter 1 of "The Printed Circuit Designer's Guide to... Thermal Management with Insulated Metal Substrates," written by Ventec International Group’s Didier Mauve and Ian Mayoh. In this free eBook, the authors provide PCB designers with the essential information required to understand the thermal, electrical, and mechanical characteristics of insulated metal substrate laminates.

3D Additive Electronics Manufacturing: Are We Nearing an Inflection Point?

Recently, Dan Feinberg was invited to attend a detailed and broadly informative webinar by nScrypt titled “The Strength of 3D-Printed Electronics," which covered the status and advances in the use of 3D printing for electronic device design and manufacture. nScrypt is an Orlando-based company founded in 2002 that focuses on 3D printing. Here’s what Dan learned from each of the speakers.

One Fish, Two Fish, Red Fish, Blue Fish: Same Industry, New Look

Learning a lesson from challenges is one thing, but implementing changes based on those lessons is quite another. I-Connect007 regularly surveys leaders in the electronics industry to bring you important and relevant information that helps you make better decisions. What lessons have you learned during the COVID-19 crisis, and what changes have you made?

A Design Economics Primer

When you start a new design, do you begin tracking costs right away, or do you wait until you have a functioning product before you start looking at the dollars and cents? Chris Young begins cost-aware design before the design cycle has even begun. Andy Shaughnessy and Nolan Johnson recently interviewed Chris, an engineer with The Goebel Company and founder of Young Engineering Services, and asked him to explain his approach to design economics.

IPC’s Shawn Dubravac: COVID-19 Outbreak Accelerates Industry Shifts Already Under Way

On May 19, Barry Matties spoke with Shawn Dubravac, chief economist for IPC. While discussing other topics, Matties asked for Dubravac’s perspective on shifts in the market, who observed that the recessionary trend might be behind us; the markets are already showing recovery. Still, it could take a year or so to fully recover.

IPC's Dr. John Mitchell: Leadership in Times of Crisis

On May 13, Dr. John Mitchell, IPC president and CEO, spoke with Barry Matties and Nolan Johnson in another installment in our series of industry updates. In this interview, Mitchell discussed the challenges of leadership in crisis situations.


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