Not a member? Register here
There are several testing methods used for certifying that the circuit board meets its defined quality level and intended functional criteria. Multilayer circuit boards have become increasingly complex: finer conductor line definition, blind and buried microvia interface, and smaller, finer-pitch SMT land pattern geometries. Visual assessment using automated optical inspection (AOI) is adopted to check all circuit layers prior to lamination and as a final examination of the end product.
With the benefit of more than half a century of experience in the printed circuit and electronics interconnection industry, I now enjoy a perspective that is not available to those just entering into the industry. I harken often to a comment I chanced upon a few decades back made by legendary Swedish film director, Ingmar Bergman, who expressed in an interview, “Old age (growing old) is like climbing a mountain. You climb from ledge to ledge. The higher you get, the more tired and breathless you become, but your views become more extensive.” That perspective is truly a gift, regardless of what one does in life. It certainly has resonated with me (even before I arrived here.)
Nick Koop, director of flex technology at TTM Technologies, reflects on the powerful impact the electronics manufacturing industry has had on the world, as well as the many learning opportunities offered by actively participating in IPC. Nick urges aspiring young professionals to reach out and create the lasting connections that will guide them throughout their careers.
We were back in San Diego, maybe for a “long vacation,” as IPC APEX EXPO is in Anaheim next year. Before we get to Anaheim, though, let’s talk about the show: It was a great week. I spent Sunday and Monday visiting some excellent Professional Development courses. As you know, this is a fast-changing industry, and we have to keep learning to stay ahead. On Monday, I attended the Microvia Weak Interface/Reliability subcommittee, and on Tuesday, the Ultra-HDI Technology Committee.
Electronic assemblies are typically comprised of a mix of discrete resistors, capacitors, inductors, and the like, along with numerous integrated circuit chips, each chip having a certain function or range of different functions. In such assemblies, there are also several different connectors and/or sockets that allow for the assembly to be connected to other assemblies. Making interconnections between and among these many and various active and passive devices is the job of the circuit designer. To date, a broad range of IC packaging and electrical interconnection techniques have been used in such assemblies, especially at the higher end.
